Heatpipe Cooling System for Memory Modules
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Solution Overview
Problem
Traditional cooling systems for electronic components are thermally insufficient, especially in densely packed systems with increasing heat generation due to higher computing power and smaller component sizes.
Innovation Solution
A heatpipe cooling system with an evaporator assembly thermally contacting heat-producing devices to absorb thermal energy and a condenser assembly to dissipate it, using a thermally-conductive cooling fluid like water, ethanol, acetone, or mercury, and thermally-conductive deflectable members for enhanced heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If traditional fan-based air cooling systems are used, then the system structure is simple and easy to manufacture, but the thermal cooling effectiveness is insufficient for high-density electronic components
Solution Approach 1:
The patent employs phase transition of cooling fluid (evaporation and condensation) to transfer heat away from electronic components. The evaporator assembly absorbs heat by evaporating cooling fluid, which then condenses in the condenser assembly, providing efficient thermal management for high-density electronics without requiring complex fan-based air cooling systems
Solution Approach 2:
The patent uses a closed-loop liquid cooling system with evaporator and condenser assemblies connected by tubing. The cooling fluid circulates through this hydraulic system, absorbing heat at the evaporator and dissipating it at the condenser, replacing the inadequate air-based cooling with a more effective liquid-based thermal management system
2Productivity
If electronic components are made smaller and densely packed to increase computing power, then the system board density increases, but the heat generation per unit area increases making cooling more difficult
Solution Approach 1:
The patent applies localized thermal management by placing evaporator assemblies in direct thermal contact with specific heat-generating components such as memory modules and processor assemblies. The deflectable members conform to component surfaces to ensure optimal thermal coupling at critical hot spots, providing targeted cooling where computing power is highest
Solution Approach 2:
The phase transition mechanism enables high heat flux removal from densely packed components. The evaporating cooling fluid absorbs large amounts of latent heat directly at the component surfaces, efficiently managing the increased heat generation from high-density electronics without requiring proportional increases in cooling system size
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively manages heat transfer through phase transition, ensuring efficient thermal energy absorption and dissipation, thereby addressing the thermal insufficiency of traditional cooling systems.
Implementation Method 1
A cooling fluid may be configured to be at least partially evaporated within the evaporator assembly
Implementation Method 2
effectively manages heat transfer through phase transition
Implementation Method 3
A cooling fluid may be configured to be at least partially condensed within the condenser assembly
Implementation Method 4
The evaporator assembly includes one or more thermally-conductive deflectable members configured to extend from a surface of the evaporator assembly and contact a surface of the one or more memory modules
Data Source
AI summary
A cooling system includes an evaporator assembly configured to thermally contact one or more memory modules and absorb thermal energy from the one or more memory modules. A condenser assembly is thermally coupled to the evaporative assembly and configured to receive and dissipate at least a portion of the thermal energy absorbed by the evaporative assembly.