Heatsink Package Recess Structure Without Grinding Damage
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Solution Overview
Problem
Existing manufacturing methods for electronic packages are inefficient and prone to mechanical stress and defects due to the need for grinding, which requires a flat thermally conductive substrate and can result in scratches or damage.
Innovation Solution
The method involves forming a recess in the package material to expose only a desired portion of the thermally conductive substrate, eliminating the need for grinding and allowing for the use of substrutes with overflow recesses or holes, which reduces mechanical stress and improves reliability by controlling the bond line thickness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a grinding process is used to expose the thermally conductive substrate, then the substrate surface can be exposed to the outside of the package, but the processing time is long and mechanical stress causes defects such as scratches or damage
Solution Approach 1:
The patent extracts only the necessary portion of the package material through a recess formation process, exposing the thermally conductive substrate surface without requiring extensive grinding. This selective removal approach achieves the required planar uniformity while significantly reducing processing time and mechanical stress on the substrate.
Solution Approach 2:
The patent replaces the traditional mechanical grinding process with an alternative method that forms a recess in the package material. This substitution eliminates the prolonged mechanical contact and friction that cause scratches and damage, while still achieving the necessary substrate exposure and planar uniformity.
2Reliability
If the thermally conductive substrate is made flat to minimize damage risk, then mechanical stress during manufacturing is reduced, but the manufacturing process still requires grinding which increases processing time
Solution Approach 1:
The patent performs preliminary action by forming the recess in the package material before final substrate exposure is needed. This advance preparation allows the thermally conductive substrate to be exposed through a pre-formed recess rather than requiring post-assembly grinding, thereby maintaining substrate integrity while improving manufacturing efficiency.
3Manufacturing precision
If grinding is used to achieve planar uniformity, then the substrate surface is exposed uniformly, but mechanical stress induces defects such as scratches or damage
Solution Approach 1:
The patent extracts material selectively to form a recess that exposes the thermally conductive substrate surface with the required planar uniformity. This targeted extraction approach achieves precision without applying the widespread mechanical stress that causes scratches and damage across the entire substrate surface.
Solution Approach 2:
The patent substitutes the mechanical grinding system with a recess formation process that minimizes mechanical stress. This replacement method achieves the necessary planar uniformity for substrate exposure while avoiding the harmful friction and pressure that generate scratches and structural damage.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables more efficient and reliable manufacturing of electronic packages with reduced mechanical stress and improved planar uniformity, facilitating heat dissipation and orientation identification, while preventing attaching material from bleeding onto the electronic component.
Implementation Method 1
a thermally conductive second substrate (4) comprising a first portion (4a) and a second portion (4b) integrally connected to the first portion (4a), wherein at least the first portion (4a) among the first and second portion is fixedly attached to the electronic component (6)
Data Source
Figure 1A~1B
Figure 2A~2C
Figure 2D~2E
AI summary
Aspects of the present disclosure generally relate to an electronic package and to a method for manufacturing the same. The electronic package comprises a first substrate, an electronic component arranged on and/or formed in the first substrate, a thermally conductive second substrate comprising a first portion and a second portion integrally connected to the first portion, wherein at least the first portion among the first and second portion is fixedly attached to the electronic component, and a package material arranged to encapsulate the electronic component and to at least partially encapsulate the first and second substrate, wherein the package material comprises a recess formed therein that extends up to a surface of the first portion.