Plastic Heatsink Positioning Device with Hooks and Flexible Rods
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Solution Overview
Problem
Conventional positioning devices for connecting heatsinks to chip sets face issues such as fatigue in metallic clips, potential damage during installation, interference with electronic components, and reduced heat transfer due to incomplete engagement and narrow gaps between the chip set and circuit board.
Innovation Solution
A positioning device with two or three hooks on side plates that hook onto the chip set, combined with flexible rods and protrusions to ensure secure engagement and minimize interference, allowing for effective heat transfer without damaging the chip set or circuit board.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional metallic clips are used to connect heatsink to chip set, then the heatsink can be secured to the chip set, but the clips reach fatigue limit quickly and may damage the chip set during installation
Solution Approach 1:
The patent replaces durable metallic clips with disposable plastic positioning devices that are inexpensive to manufacture and replace. These positioning devices perform the function of securing the heatsink but are designed to be replaced rather than reused, avoiding fatigue issues while maintaining connection reliability during installation and operation.
Solution Approach 2:
The patent introduces plastic positioning devices as intermediary components between the heatsink and chip set socket. These positioning devices have hooks that engage with the socket structure without directly contacting or stressing the chip set, thereby preventing damage during installation while still achieving secure connection.
2Reliability
If conventional positioning devices with multiple hooks are used, then the heatsink can be positioned securely, but the hooks may not engage properly with the chip set sides causing incomplete heat transfer
Solution Approach 1:
The patent removes the problematic hook structure from the positioning device design. Instead of using hooks that may fail to engage properly with the chip set sides, the invention uses a simplified structure where the positioning device sits on the heatsink base and engages with the socket through side plates and positioning rods, ensuring reliable positioning without compromising heat transfer contact between the heatsink and chip set.
3Manufacturing precision
If slots are defined in the heatsink for side plate engagement, then the positioning device can be well positioned to the heatsink, but the slots reduce the area for removing heat from the chip set
Solution Approach 1:
The patent eliminates the need for slots in the heatsink by removing the side plate engagement mechanism that required them. The positioning function is achieved through positioning rods that engage with the socket structure and a base structure that contacts the heatsink, eliminating the heat-dissipating slots while maintaining positioning accuracy.
4Ease of operation
If heat dispensing tapes are used to connect heatsink with circuit board, then the heatsink can be secured in the narrow gap, but the tapes are easily dry and removed from the surface
Solution Approach 1:
The patent introduces a rigid plastic positioning device as an intermediary structure that spans the narrow gap between the chip set and circuit board. This positioning device provides mechanical support and secure engagement through its hook and side plate structures, replacing the unreliable adhesive tapes with a durable mechanical connection that maintains connection reliability over time.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a secure and efficient connection that prevents interference with electronic components and ensures complete heat transfer from the chip set to the heatsink, even in narrow gaps, thereby maintaining optimal operation.
Implementation Method 1
A plurality of flexible rods extend from insides of the rectangular frame. Each flexible rod has a protrusion extending downward from a distal end thereof
Implementation Method 2
One of the two side plates 11 has one hook 111 extending from an inside thereof, and the other side plate 11 has two hooks 111 extending from an inside thereof
Implementation Method 3
heat from the chip set cannot conduct to the heatsink as desired
Data Source
AI summary
A positioning device for connecting a heatsink to a chip set includes a rectangular frame having a through hole in a center thereof, two side plates extending from two opposite sides thereof and each side plate has one hook extending from an inside thereof. Two positioning rods extend from the other two opposite sides of the rectangular frame, and a plurality of flexible rods extend from insides of the rectangular frame. The heatsink extends through the through hole of the rectangular frame and the positioning rods insert through apertures in the heatsink. The hooks are hooked to two sides of the chip set and the flexible rods press on the heatsink.