Heatsink Protruding Element for Thermal Stability
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Miniaturization of electronic components leads to increased junction temperature issues due to concentrated heat generation, causing mechanical instability and potential damage in heatsinks, especially in small packages, which can result in malfunction or detachment from the package.
Innovation Solution
Extending the heatsink with a protruding element that includes a connection portion on the free surface and a mounting portion extending to the mounting surface, providing mechanical stability and improved heat dissipation by attaching the heatsink to the board, thereby distributing weight and reducing the risk of contact deterioration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the heatsink is miniaturized to match small electronic component packages, then the heat dissipation capability is improved, but the mechanical stability deteriorates causing detachment or malfunction
Solution Approach 1:
The heatsink structure is extended from a conventional two-dimensional base into the third dimension by adding a mounting portion that reaches through the insulating body to contact the mounting surface. This vertical extension provides additional attachment points and distributes mechanical stress across multiple surfaces, resolving the contradiction between miniaturization and mechanical stability.
Solution Approach 2:
The heatsink mounting portion is nested within the insulating body structure, extending from the free surface through the insulating material to reach the mounting surface. This nested configuration allows the heatsink to be mechanically integrated into the package structure without increasing the external footprint, maintaining stability while accommodating miniaturization.
2Stability of the object's composition
If the heatsink is extended to improve mechanical stability, then the mechanical stability is improved, but the device complexity increases
Solution Approach 1:
The extended heatsink structure serves multiple functions simultaneously: it provides thermal conduction path from the chip to external environment, acts as a mechanical anchor to improve stability, and creates additional mounting surfaces for attachment. This multi-functionality reduces the need for separate structural support elements, offsetting the increased geometric complexity.
Solution Approach 2:
The mounting portion of the heatsink is merged with the thermal conduction path, combining the mechanical support function and thermal management function into a single integrated structure. This eliminates the need for separate mounting brackets or support structures, reducing overall device complexity despite the extended geometry.
3Ease of manufacture
If the heatsink is attached only to the free surface, then the ease of manufacture is improved, but the reliability deteriorates due to contact deterioration or detachment
Solution Approach 1:
The heatsink mounting portion is pre-formed as an integral part of the heatsink structure during manufacturing, extending ready-to-connect to the mounting surface. This preliminary configuration eliminates the need for post-assembly modifications or additional fastening operations, maintaining ease of manufacture while establishing multiple predetermined contact points for improved reliability.
Solution Approach 2:
The mounting portion acts as an intermediary element that bridges the heatsink base and the mounting surface, distributing mechanical and thermal loads across the insulating body. This intermediary structure provides stable electrical and thermal contact paths while protecting against direct stress on the primary attachment points.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances mechanical stability and heat dissipation, preventing junction temperature-related damage and ensuring reliable operation by securely attaching the heatsink to the board, thus maintaining effective heat transfer and preventing contact failures.
Implementation Method 1
The heatsink facilitates the transfer of heat by conduction (thanks to its good thermal conductivity) from the chip to itself
Implementation Method 2
the heatsink is usually formed with a structure designed to facilitate a transfer of heat by convection (for example, with a plurality of fins extending from a base) to the environment outside the package
Data Source
AI summary
An insulating body embeds an integrated circuit and has a mounting surface, an opposite free surface, and at least one pin exposed along an edge of the mounting surface and electrically connected to a terminal of the integrated circuit. A heatsink configured to dissipate heat produced by the integrated circuit is provided in correspondence of the free surface. The heatsink includes at least one protruding element including a connection portion partly extending in contact with the free surface and partly protruding beyond a boundary of the free surface (the connection portion having a free end being distal from the insulating body), and a mounting portion extending from the free end at least up to a plane of the mounting surface. The heatsink is further electrically connected to a terminal of the integrated circuit chip. The protruding element is placed in correspondence of the at least one pin.