Heatsink Shield Indentations for Thermal Grounding

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Solution Overview

Problem

Existing thermal management systems in electronic devices face challenges in providing sufficient grounding of heatsinks while maintaining effective heat dissipation, especially in compact designs with increased component density, leading to insufficient grounding and potential frequency interference issues.

Innovation Solution

A heatsink assembly comprising a shield with indentations for thermal pads, a thermally conductive spacer, and a heatsink fastened to the printed circuit board using fasteners like compression spring pins or spring clips, ensuring proper thermal contact and grounding without interference.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Object-affected harmful factors

If a shield is used to contain frequency interference, then electromagnetic shielding is improved, but thermal contact between the heatsink and thermal pad deteriorates

Engineering Contradiction:

Improvefrequency interferenceVSAvoidthermal contact

Core Design Contradiction:

Object-affected harmful factorsVSTemperature

Solution Approach 1:

The shield surface is segmented with multiple openings and indentations to create localized thermal contact zones. The openings allow heat to pass through the shield while the indentations provide direct thermal pathways from the thermal pad to the heatsink, maintaining thermal effectiveness while preserving electromagnetic shielding in other areas.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The shield is designed with non-uniform local properties: openings and indentations are strategically positioned to create high thermal conductivity zones directly over heat-generating components, while the rest of the shield maintains continuous shielding coverage. This localized modification allows thermal management without compromising overall electromagnetic interference protection.

Inventive Principle:

Principle #3Local quality

2Temperature

If the heatsink is fastened directly to the thermal pad, then thermal contact is improved, but sufficient grounding through the shield deteriorates

Engineering Contradiction:

Improvethermal contactVSAvoidgrounding

Core Design Contradiction:

TemperatureVSReliability

Solution Approach 1:

The shield acts as an intermediary element between the heatsink and the thermal pad. The heatsink is fastened to the shield rather than directly to the thermal pad, and the shield is in turn positioned over the thermal pad with thermal contact. This intermediary arrangement allows both thermal transfer and electrical grounding to occur through the shield, resolving the conflict between thermal contact and grounding requirements.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Volume of moving object

If component density is increased to reduce device size, then compactness is improved, but heat concentration deteriorates

Engineering Contradiction:

Improvedevice sizeVSAvoidheat concentration

Core Design Contradiction:

Volume of moving objectVSTemperature

Solution Approach 1:

The shield with openings and indentations creates additional thermal pathways in the vertical dimension, allowing heat to escape through multiple routes (conduction through the shield, convection through openings) rather than relying solely on horizontal heat spread. This dimensional approach to heat management enables effective thermal dissipation in compact, high-density configurations.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively enhances heat dissipation and prevents frequency interference by ensuring sufficient grounding of the heatsink, maintaining optimal component temperatures and reducing size constraints in electronic devices.

Implementation Method 1

The thermally conductive spacer is positioned within the at least one indentation on the shield. The heatsink is positioned over the thermally conductive spacer

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

a heatsink assembly comprising a shield, a thermally conductive spacer and a heatsink... effectively enhances heat dissipation

Methodology Applied

Scientific EffectHeat dissipation: Heat Sink

Implementation Method 3

at least one fastener that fastens the shield, thermally conductive spacer and heatsink to the printed circuit board

Methodology Applied

Scientific EffectMechanical fastening: Mechanical Fastener

Data Source

PatentUS11659689B2Heatsink assembly for an electronic device

Publication Date: 2023.05.23 INTERDIGITAL MADISON PATENT HLDG

AI summary

A heatsink assembly for an electronic device is described. The heatsink assembly includes a shield, a thermally conductive spacer and a heatsink. The shield has at least one indentation on a surface thereof that is positioned over a component needing thermal dissipation that is attached to the printed circuit board. The thermally conductive spacer is 5 positioned within the at least one indentation on the shield. The heatsink is positioned over the thermally conductive spacer and fastened to the printed circuit board.