Heatsink Connection to Source Electrode for Parasitic Inductance Reduction
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Solution Overview
Problem
Electronic devices with semiconductor chips face inefficiencies due to parasitic source- or emitter-inductance, which is more critical than drain- or collector-inductance, affecting overall device performance.
Innovation Solution
The solution involves connecting a heatsink to the source or emitter electrode instead of the drain or collector electrode, and using a contact element to electrically connect the heatsink, while ensuring thermal but not electrical connection, to improve efficiency by reducing parasitic inductance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If the heatsink is connected to the drain or collector electrode, then the thermal management is simplified, but the parasitic inductance increases and device efficiency decreases
Solution Approach 1:
The patent inverts the conventional connection approach by connecting the heatsink to the source or emitter electrode instead of the drain or collector electrode. This inversion reduces the length of current paths and minimizes parasitic inductance, thereby improving device efficiency while maintaining thermal management functionality
Solution Approach 2:
The patent introduces a contact element as an intermediary component to electrically connect the heatsink to the source or emitter electrode. This contact element serves as a mediator that enables the non-conventional connection while maintaining electrical connectivity and managing the complexity of the connection configuration
2Loss of energy
If the contact element provides both thermal and electrical connection, then the connection is simplified, but the parasitic inductance increases
Solution Approach 1:
The patent segments the connection functions by providing separate connection paths: one for thermal management (heatsink to source/emitter) and another for current flow (drain/collector to load). This segmentation allows thermal and electrical connections to be optimized independently, reducing parasitic inductance while managing connection complexity
Solution Approach 2:
The contact element acts as an intermediary that enables the heatsink connection to the source or emitter electrode, facilitating both thermal and electrical connectivity while maintaining the ability to optimize current paths separately to minimize parasitic inductance
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the efficiency of the electronic device by minimizing parasitic inductance, thereby improving performance and stability.
Implementation Method 1
connecting a heatsink to the source or emitter electrode... ensuring thermal but not electrical connection
Implementation Method 2
using a contact element to electrically connect the heatsink... reducing parasitic inductance
Data Source
AI summary
An electronic device includes a semiconductor chip including an electrode, a substrate element and a contact element connecting the electrode to the substrate element. The electronic device further includes an encapsulant configured to leave the contact element at least partially exposed such that a heatsink may be connected to the contact element.