Heatsink Support Stud for PCB Vibration Resistance
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Solution Overview
Problem
Integrated circuit components generate significant heat, requiring large and heavy heatsinks that can be inadequately secured, leading to potential cracking due to vibration and mechanical shock, and competing for space on circuit boards with other components.
Innovation Solution
A heatsink support system that uses a support stud with a threaded bore inserted into the circuit board, secured by a threaded fastener passing through the heatsink and board, and a capture mechanism to firmly attach the circuit board to an adjacent surface, minimizing space usage and ensuring stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a large and heavy heatsink is used to dissipate heat from integrated circuit components, then heat dissipation capability is improved, but the weight and size of the component assembly increases
Solution Approach 1:
The patent combines the heatsink support function with the circuit board structure itself by integrating support studs directly into the board. This merging eliminates the need for separate support mechanisms and reduces overall assembly weight while maintaining effective heat dissipation capability through proper heatsink positioning and securing.
2Temperature
If a large and heavy heatsink is used to dissipate heat from integrated circuit components, then heat dissipation capability is improved, but the space occupied on the circuit board increases
Solution Approach 1:
The patent utilizes the vertical dimension by extending support studs through the circuit board thickness to secure the heatsink. This dimensional approach allows the heatsink to be firmly positioned without requiring additional lateral space on the circuit board surface, thereby maintaining compact layout and optimizing space utilization while ensuring effective heat dissipation.
3Ease of operation
If the heatsink is insufficiently secured, then ease of installation is improved, but reliability deteriorates due to cracking from vibration and mechanical shock
Solution Approach 1:
The patent incorporates support studs pre-integrated into the circuit board during board manufacturing. This preliminary action ensures that when the heatsink is installed, immediate and reliable support is already in place, preventing movement and potential cracking from vibration and mechanical shock right from the outset, while maintaining ease of heatsink installation.
4Reliability
If additional support mechanisms are added to secure the heatsink firmly, then reliability is improved, but device complexity increases
Solution Approach 1:
The patent merges the support function into the circuit board structure itself through integrated support studs. This consolidation eliminates the need for separate support components and mechanisms, thereby maintaining high reliability for heatsink securing while reducing overall device complexity and the number of parts required.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides firm support to the heatsink, reducing the impact of vibration and mechanical shock on integrated circuit components while optimizing space on circuit boards by eliminating the need for additional threaded nuts.
Implementation Method 1
A threaded fastener passes through the opening of the heatsink and the opening of the circuit board and enters the threaded support stud, thereby securing the heatsink to the circuit board
Implementation Method 2
The support stud with a threaded bore is inserted into the opening of the circuit board from the second side of the circuit board
Implementation Method 3
A capture mechanism is disposed on a surface adjacent the circuit board. The capture mechanism receives the support stud, thereby coupling the circuit board to the adjacent surface
Data Source
AI summary
Described is an apparatus for use supporting a heatsink thermally coupled to an integrated circuit component disposed on a first side of a circuit board. The heatsink has an opening that is aligned with an opening of the circuit board. The apparatus includes a support stud disposed beneath the heatsink on a second side of the circuit board. The support stud has a bore and is press fit into the opening of the circuit board from the second side and secured within the opening of the circuit board by a fastener passing through the aligned openings of the heatsink and the circuit board and into the bore. A capture mechanism, disposed on a surface adjacent and parallel to the second side of the circuit board, receives the support stud, thereby coupling the circuit board to the adjacent surface.