Heatspreader Force Control Protrusion for IC Package Die Crash Prevention
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Solution Overview
Problem
Integrated circuit packages face challenges in accommodating increased power requirements and dimensional variations, leading to risks of die crashing during molding due to height variations and warping, which affect manufacturing yield and reliability.
Innovation Solution
A substrate with a heatspreader featuring a force control protrusion and support posts that redistribute assembly forces away from the integrated circuit die, ensuring the encapsulant covers the die while maintaining structural integrity and flexibility, preventing die crashing and improving thermal conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a heatspreader is attached to the top of the integrated circuit die, then thermal management is improved, but the risk of die crashing during molding increases due to height variations and warping
Solution Approach 1:
The patent applies beforehand cushioning by introducing a compressible material between the heatspreader and the integrated circuit die. This cushioning layer is placed in advance to compensate for height variations and warping that occur during molding, preventing the die from crashing while maintaining effective thermal contact between the heatspreader and die
2Reliability
If the protective housing is filled with liquid potting material during molding, then the integrated circuit die is protected, but the mold, molding material or other elements are susceptible to crashing the die due to height variations
Solution Approach 1:
The compressible material serves as a beforehand cushioning element that accommodates dimensional variations during the molding process. It allows the mold to close properly and fill the protective housing with potting material without transmitting excessive force that could crash the die, thus maintaining both die protection and molding precision
3Manufacturing precision
If dimensional tolerances are tightened to prevent die crashing, then manufacturing yield improves, but the complexity of the packaging process increases
Solution Approach 1:
The patent changes the physical state and compressibility parameters of the material between the heatspreader and die. By selecting a compressible material with appropriate mechanical properties, the system accommodates dimensional variations without requiring tight tolerances on other components, thus improving manufacturing yield while avoiding increased process complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively redistributes assembly forces, enhances the spring action of the heatspreader, and maintains physical and electrical integrity, reducing the risk of die crashing and improving manufacturing yield by accommodating dimensional variations and thermal expansion.
Implementation Method 1
A substrate with a heatspreader featuring a force control protrusion and support posts that redistribute assembly forces away from the integrated circuit die
Implementation Method 2
enhances the spring action of the heatspreader, and maintains physical and electrical integrity, reducing the risk of die crashing and improving manufacturing yield by accommodating dimensional variations and thermal expansion
Implementation Method 3
improving thermal conductivity
Data Source
AI summary
An integrated circuit package system includes providing a substrate having an integrated circuit, attaching a heatspreader having a force control protrusion on the substrate, and forming an encapsulant over the heatspreader and the integrated circuit.