Heatspreading Lid With Integrated Separators for Multi-Chip Cooling
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Solution Overview
Problem
Conventional semiconductor packages face challenges in thermal management, which affects their durability and performance as they generate more heat with increased speed and capacity, leading to potential reliability issues.
Innovation Solution
A semiconductor module design featuring a substrate with a heat radiation structure that includes a thermally conductive layer and a heat radiation structure with distinct parts connected on the edge region of the substrate, providing efficient heat dissipation and increased durability through secure attachment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If semiconductor packages increase speed and capacity, then performance is improved, but heat generation increases leading to thermal management issues
Solution Approach 1:
The patent converts the harmful heat generated by high-performance semiconductor packages into a manageable thermal flow by designing a heat radiation structure that directs heat away from the chip. The heat dissipation fin structure transforms the problematic thermal energy into a controlled heat transfer process, where the heat is conducted through the substrate and radiated away through the fins, thus converting the harm (excessive heat) into a beneficial controlled thermal management system.
2Temperature
If a heat radiation structure is added to semiconductor packages, then thermal management is improved, but device complexity increases
Solution Approach 1:
The patent merges the heat radiation function with the existing substrate structure. The heat dissipation fins are integrated directly into the substrate, eliminating the need for separate heat sinks or thermal management components. This integration reduces device complexity while maintaining effective heat dissipation, as the substrate simultaneously serves as both the mounting platform for semiconductor chips and the heat conduction pathway to the radiation fins.
3Reliability
If the heat radiation structure is securely attached to the substrate, then durability is improved, but manufacturing precision requirements increase
Solution Approach 1:
The patent segments the heat radiation structure into multiple fins that are distributed across the substrate surface. This segmentation allows for more flexible attachment methods and reduces the precision requirements for any single attachment point. The modular fin structure can be attached through various means (soldering, adhesives, or mechanical attachment) at multiple locations, distributing the attachment requirements and reducing the overall manufacturing precision burden while maintaining secure attachment and high durability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively dissipates heat generated by semiconductor packages, enhancing the durability and reliability of the semiconductor module by securely fixing the heat radiation structure to the substrate, thus addressing thermal management challenges.
Implementation Method 1
a thermal conductive layer disposed between the heat radiation structure and the semiconductor packages
Data Source
AI summary
A semiconductor module includes a substrate having a central region, an outer region that surrounds the central region, and a middle region disposed between the central and the outer region, a first semiconductor package mounted on the central region of the substrate, a plurality of second semiconductor packages mounted on the middle region of the substrate, and a heat radiation structure disposed on the first semiconductor package and second semiconductor packages. The heat radiation structure includes a first part that is disposed on top surfaces of the first and second semiconductor packages, a second part that surrounds the middle region, a third part that is spaced apart from the second part and surrounds the first semiconductor package, and a fourth part that connects the second part to the third part.