Height-Aware Image Generation for Component Mounting Verification
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Solution Overview
Problem
Existing technologies fail to accurately visualize the up-down positional relationship of overlapping electronic components during mounting, making it difficult to detect errors in the mounting data.
Innovation Solution
An image data generation device that generates distinct visual aspects for overlapping electronic components based on their height positions, allowing operators to discern which components are mounted above or below each other, and highlights potential errors in positional relationships.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If multiple electronic components are displayed in the same aspect on the screen, then the display is simple and uniform, but the operator cannot determine the up-down positional relationship of overlapping components
Solution Approach 1:
The patent applies color changes by displaying overlapping electronic components in different colors based on their up-down positional relationship. Specifically, components are displayed in a first color when they are in a first up-down position and a second color when they are in a second up-down position, enabling operators to visually distinguish the stacking order of components at a glance.
Solution Approach 2:
The patent applies asymmetry by displaying overlapping electronic components in different aspects ( orientations) according to their up-down positional relationship. Components in different stacking positions are rendered with different display aspects, creating an asymmetric visual representation that clearly indicates the hierarchical relationship between overlapping components.
2Reliability
If height information is used to detect errors in overlapping components, then errors in the same layer can be detected, but errors in up-down positional relationships between different layers cannot be detected
Solution Approach 1:
The patent introduces a visual display intermediary that translates height information and up-down positional relationships into graphical representations. By displaying overlapping components in different colors and aspects based on their positional relationships, the system provides an intuitive visual intermediary that reveals stacking order information without requiring operators to interpret raw height data.
Solution Approach 2:
The patent implements feedback by providing visual information about the up-down positional relationships of overlapping components through color and aspect variations. This visual feedback enables operators to immediately understand the stacking order and identify potential errors in mounting data, allowing for real-time verification and correction.
3Manufacturing precision
If components are displayed without visual differentiation, then the display process is simple, but operators cannot visually confirm correct mounting positions of overlapping components
Solution Approach 1:
The patent applies color changes to differentiate overlapping electronic components based on their up-down positional relationships. Components are displayed in distinct colors according to their stacking positions, enabling operators to visually confirm correct mounting positions and detect potential errors in the manufacturing process.
Solution Approach 2:
The patent applies dimensionality change by representing three-dimensional stacking positions through two-dimensional visual differences in color and aspect. This allows the system to convey vertical positional information (height direction) through visual attributes on a flat display screen, enabling accurate verification of overlapping component positions.
Data Source
AI summary
The image data generation device includes a component information input section and an image data generation section. The component information input section is configured to input a mounting position and an outer shape of the electronic component for each of the multiple electronic components to be mounted in the mounting processing. The mounting position includes a position in a height direction orthogonal to a surface of the board. The image data generation section is configured to generate image data for displaying a state when each of the multiple electronic components to be mounted in the mounting processing is arranged at the mounting position of the electronic component based on the mounting position and the outer shape of the electronic component input by the component information input section.


