Height-Stacked Optical Module Architecture for Fiber Routing
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Solution Overview
Problem
Existing Co-Packaged Optics (CPO) technology faces challenges in configuring optical modules with more active and passive components for higher transmission rates, such as 1.6 Tbps, 3.2 Tbps, or 6.4 Tbps, while maintaining compactness and minimizing interference between optical fibers.
Innovation Solution
The optical module design includes a motherboard and daughter board with transmitting optical assemblies at different heights, utilizing a bending fiber array and covers to prevent fiber interference, and recesses to reduce wiring length, allowing for a compact arrangement of optical communication assemblies along the lengthwise direction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If more active and passive components are configured for higher transmission rates, then transmission rate is improved, but device complexity increases
Solution Approach 1:
The optical module employs a multi-layer board structure (motherboard and daughter board) that segments different optical assemblies onto separate mounting surfaces. Transmitting optical assemblies are mounted on the first mounting surface while receiver optical assemblies are mounted on the second mounting surface, dividing the complex optical system into manageable sections that can be independently managed and maintained.
Solution Approach 2:
The patent utilizes vertical stacking of mounting surfaces at different heights to accommodate multiple optical assemblies. The first and second mounting surfaces are positioned at different heights, allowing optical fibers to be routed vertically between layers. This three-dimensional arrangement enables higher component density without increasing the horizontal footprint, thereby supporting higher transmission rates while managing device complexity.
2Volume of moving object
If optical assemblies are arranged compactly, then volume is reduced, but fiber interference increases
Solution Approach 1:
The patent resolves fiber interference by transitioning from a two-dimensional planar arrangement to a three-dimensional vertical arrangement. Optical fibers connecting assemblies on different mounting surfaces are routed vertically through the housing, utilizing the height dimension to separate fiber paths. This vertical routing prevents horizontal fiber crossings and reduces interference while maintaining compact horizontal footprint.
Solution Approach 2:
The patent introduces optical fiber routing structures as intermediary elements that mediate between closely spaced optical assemblies. These routing structures provide dedicated fiber pathways that prevent direct interference between adjacent fibers, enabling compact arrangement of transmitting and receiver optical assemblies while maintaining signal integrity.
3Length of stationary object
If optical fibers are routed directly between assemblies, then length of wiring is reduced, but fiber interference increases
Solution Approach 1:
The patent routes optical fibers vertically between mounting surfaces at different heights, utilizing the height dimension to create direct but non-interfering fiber paths. This vertical routing through the housing allows for relatively short fiber lengths while preventing horizontal fiber crossings that would cause interference, thus achieving both short wiring length and minimal interference.
Data Source
AI summary
An optical module, including housing, at least one optical coupler, motherboard, daughter board, first transmitting optical assembly, second transmitting optical assembly, receiver optical assembly, at least one first inner optical fiber, at least one second inner optical fiber, and third inner optical fibers. At least one optical coupler is disposed within housing. Motherboard is disposed in housing. Daughter board is disposed in housing and disposed on mounting surface of motherboard. First transmitting optical assembly is disposed on mounting surface of motherboard. Second transmitting optical assembly is disposed on mounting surface of daughter board, and mounting surface and mounting surface of motherboard face identical direction. Receiver optical assembly is disposed on mounting surface of motherboard. At least one first inner optical fiber optically couples first transmitting optical assembly and at least one optical coupler. Third inner optical fibers optically couple receiver optical assembly and at least one optical coupler.