Hardware Enabled Interpolating Sensor for Anti-Aliased Signal Acquisition

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Solution Overview

Problem

Conventional pixellated sensors are expensive to manufacture, prone to moiré patterns, and computationally intensive interpolation methods introduce unwanted artifacts, complicating signal sampling and image reconstruction.

Innovation Solution

A hardware-enabled interpolating sensor (HEIS) with an addressable array of conductors on opposing sides of a transducer layer, allowing for non-aliased signal processing and interpolation between junctions, enabling efficient reconstruction of wavefronts and emission of signals with variable size and intensity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If conventional pixellated sensors are used, then discrete signal sampling is achieved, but manufacturing cost increases and moiré patterns occur

Engineering Contradiction:
Improvesignal sampling accuracyVSAvoidmanufacturing cost
Core Design Contradiction:
Measurement precisionVSEase of manufacture

Solution Approach 1:

The patent replaces the conventional mechanical pixellated sensor structure with a hardware-enabled interpolating sensor that uses an addressable array of conductors and transducer elements. This substitution allows for continuous signal sampling across the sensor surface rather than discrete pixel sampling, eliminating moiré patterns while reducing manufacturing complexity through a more straightforward conductor-transducer architecture.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

2Measurement precision

If computational interpolation is applied to pixellated sensors, then image smoothing is achieved, but unwanted artifacts are introduced and processing complexity increases

Engineering Contradiction:
Improveimage qualityVSAvoidsignal processing complexity
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The patent performs interpolation in the hardware domain before signal digitization and processing. By using an addressable array of conductors that can be selectively activated to create virtual sensing points between physical transducer elements, the system performs interpolation physically rather than computationally. This preliminary hardware-based interpolation eliminates the need for complex post-processing algorithms and prevents artifact introduction that occurs with digital interpolation methods.

Inventive Principle:
Principle #10Preliminary action

3Ease of manufacture

If hardware-enabled interpolating sensor is used, then manufacturing cost is reduced and artifacts are minimized, but device structure becomes more complex

Engineering Contradiction:
Improvemanufacturing costVSAvoidsensor structure
Core Design Contradiction:
Ease of manufactureVSDevice complexity

Solution Approach 1:

The patent creates a multi-functional addressable array where conductors serve multiple purposes: they provide structural support, enable electrical addressing of individual transducer elements, facilitate signal routing, and enable hardware-based interpolation through selective activation patterns. This universal use of the conductor array reduces the need for separate components that would increase complexity, while the modular architecture allows for scalable manufacturing.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The HEIS reduces manufacturing costs, minimizes artifacts, and enhances signal processing efficiency by interpolating signals between discrete junctions, facilitating accurate image reconstruction and holographic imaging while allowing for flexible display emission.

Implementation Method 1

Each layer of conductors couples to a resistive material. The layers are disposed on opposing sides of a transducer layer, such that the conductors therein form a plurality of addressable junctions. When an impinging signal interacts with the transducer layer, a change may be read out by the addressable array

Methodology Applied
Scientific EffectPhotoelectric Effect: Photoelectric Effect

Data Source

PatentUS10180746B1Hardware enabled interpolating sensor and display
Publication Date: 2019.01.15 AMAZON TECH INC
  • US10180746B1 patent drawing
  • US10180746B1 patent drawing
  • US10180746B1 patent drawing

AI summary

A hardware enabled interpolating sensor allows for anti-aliased acquisition of data. Electrodes coupled with resistive material are disposed on either side of a transducer material, such that an impinging signal varies the electrical characteristics of the transducer material. A controller scans the electrodes and analyzes the variation in the electrical characteristics to generate data. Based upon the known characteristics of the resistive material, an interpolated image is generated from the data which is inherently anti-aliased. Additionally, an interpolating display comprising electrodes disposed on either side of an emission material is described, which allows for emission regions of varying intensity, area, and so forth.