Helical Coil Multilayer Electronic Component Pressure Distribution
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Solution Overview
Problem
Existing electronic components with helical coils on stacked magnetic material layers face issues such as positional shift and breakage due to uneven pressure distribution during bonding, leading to deteriorated coil characteristics and potential peeling or breakage of insulator layers.
Innovation Solution
The electronic component features a helical coil composed of partially cut non-circular annular wiring electrodes on stacked insulator layers, connected in series via interlayer conductors, with coil patterns displaced to create intersection portions in a plan view, dispersing thick portions and ensuring uniform pressure distribution during bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If coil patterns are arranged to fully overlap on each magnetic material layer, then the helical coil structure is formed, but the applied pressure concentrates on the thick portion causing positional shift or breakage
Solution Approach 1:
The coil pattern is segmented into multiple portions that do not fully overlap when stacked. Instead of having complete overlap between layers, the pattern is divided such that only partial overlap occurs, distributing the thick portions across different locations in the stacked structure.
Solution Approach 2:
The overlapping configuration varies at different locations of the stacked layers. By making the overlap partial rather than complete, the local thickness distribution is optimized to prevent concentration of applied pressure at any single location, thereby preventing positional shift and breakage.
2Strength
If pressure is applied to bond magnetic material layers, then bonding is achieved, but the pressure is not sufficiently transmitted to thin portions causing peeling
Solution Approach 1:
The coil pattern overlap is segmented into partial overlaps rather than complete overlap. This segmentation creates multiple distributed thick portions throughout the stacked structure, allowing pressure to be transmitted more uniformly across both thick and thin portions during bonding.
Solution Approach 2:
The problem of pressure transmission is addressed by changing the spatial arrangement of the coil patterns in the stacking direction. By controlling the overlap configuration across multiple layers, the pressure distribution is improved in the thickness dimension without compromising bonding strength.
3Reliability
If magnetic material layers are stacked with overlapping coil patterns, then the helical coil is formed, but thermal shrinkage causes breakage in thin portions
Solution Approach 1:
The coil pattern is segmented such that overlap occurs only partially between layers. This creates a distributed pattern of thick portions rather than concentrated thick regions, reducing stress concentration points that would be vulnerable to thermal shrinkage-induced breakage.
Solution Approach 2:
The local overlap configuration is optimized to create appropriate thickness distribution. By controlling where and how much overlap occurs at different locations, the structure gains resistance to thermal shrinkage while maintaining the helical coil characteristics.
Data Source
AI summary
An electronic component is provided which includes a helical coil having good coil characteristics and high reliability without peeling or breakage in each insulator layer. As compared to an existing configuration in which coil patterns are disposed on insulator layers 2a to 2d, respectively, so as to fully overlap each other in a plan view, portions where coil patterns 11 to 14 intersect each other in a plan view are dispersed and the number of the coil patterns 11 to 14 overlapping each other in each intersection portion is small. Thus, a change in thickness of a multilayer body in which the respective insulator layers 2a to 2d are stacked is suppressed. Therefore, the pressure applied when the respective insulator layers 2a to 2d are pressure-bonded is uniformly transmitted to the entire multilayer body, and thus it is possible to provide an electronic component having good coplanarity and high reliability.