Helical and Extension Antenna for Uniform Plasma Density
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Solution Overview
Problem
Existing semiconductor deposition processes face challenges in achieving uniformity of deposited layers, particularly in terms of composition, contamination levels, defect density, mechanical and electrical properties, thickness uniformity on non-planar surfaces, and gap filling between metal lines, which can lead to high electrical resistance and mechanical damage.
Innovation Solution
A plasma treatment apparatus with a helical antenna and extension antenna configuration that generates plasma with uniform density by forming electric fields within a chamber, ensuring process uniformity through the use of a helical antenna and extension antenna setup, where the extension antenna supplements the magnetic fields generated by the helical antenna to maintain consistent plasma distribution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a conventional antenna configuration is used, then the device complexity is low, but the plasma density uniformity deteriorates
Solution Approach 1:
The antenna is divided into multiple segments: a helical antenna portion and an extension antenna portion. The helical antenna provides plasma generation while the extension antenna supplements the magnetic field distribution. This segmentation allows each part to perform its specific function optimally, achieving uniform plasma density without requiring a completely different antenna design.
Solution Approach 2:
The extension antenna is disposed extending in a direction different from the helical antenna's winding direction, adding a dimensional element to the magnetic field generation. This dimensional addition helps distribute the magnetic field more uniformly across the chamber, improving plasma density uniformity while maintaining reasonable structural complexity.
2Manufacturing precision
If the extension antenna is added to supplement magnetic fields, then the plasma distribution uniformity improves, but the device complexity increases
Solution Approach 1:
The helical antenna and extension antenna are merged into a single integrated antenna system that functions as one cohesive unit. The extension antenna is electrically connected to the helical antenna, and together they generate complementary magnetic fields that collectively achieve uniform plasma distribution throughout the chamber.
3Manufacturing precision
If a single helical antenna is used, then the device complexity is low, but the magnetic field distribution uniformity deteriorates
Solution Approach 1:
The extension antenna is positioned and configured to provide enhanced magnetic field generation in specific regions where the helical antenna's field is insufficient. This local quality enhancement ensures that areas with previously poor magnetic field distribution receive adequate field strength, achieving overall uniformity without redesigning the entire antenna system.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus secures uniform plasma density and process uniformity, enhancing the quality of deposited layers and reducing the risk of electrical and mechanical issues in semiconductor devices.
Implementation Method 1
the antenna forming electric fields in the inner space to generate plasma from the source gas supplied into the inner space
Implementation Method 2
generate plasma from the source gas supplied into the inner space
Implementation Method 3
a helical antenna disposed in a helical shape from one side of the chamber toward the other side of the chamber along a first rotation direction, the helical antenna having a current flowing in the first rotation direction
Implementation Method 4
an extension antenna connected to one end of the helical antenna disposed at a side of the chamber, the extension antenna having a current flowing in a direction opposite to the first rotation direction
Data Source
AI summary
According to one embodiment of the present invention, a plasma treatment apparatus comprises: a chamber having an inner space in which processes for an object to be treated are performed; and an antenna which is arranged to cover the side part of the chamber, and which forms electric fields in said inner space to generate plasma from the source gas supplied in the inner space. The antenna includes a helical antenna which is formed into a helical shape from one side of the chamber toward the other side of the chamber along a first rotation direction, and which has a current flowing in the first rotation direction; an extension antenna which is connected to one end of the helical antenna positioned at said one side of the chamber, and which has a current flowing in the direction opposite to the first rotation direction; and a connection antenna for interconnecting the extension antenna and the helical antenna.