Helical Groove Nozzle for Slurry Recirculation
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Solution Overview
Problem
Current mechanical mixers used in the semiconductor industry for recirculating CMP slurries cause shearing of particles, leading to detrimental effects on slurry health and inability to maintain homogeneity over extended periods without preliminary mixing methods like rollers or tumblers.
Innovation Solution
An apparatus comprising a base portion, an inlet portion, a coupler, and a nozzle member with a helical groove that minimizes slurry shear by creating a 360-degree upward swirl, eliminating the need for mechanical mixers and maintaining homogeneity through a recirculation system.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If a mechanical mixer is used to maintain homogeneity of CMP slurry, then mixing effectiveness is improved, but particle shearing occurs which deteriorates slurry health
Solution Approach 1:
The patent removes the mechanical mixer from the slurry recirculation system entirely. Instead of using a mechanical mixing device, the system relies on the natural recirculation flow to maintain slurry homogeneity, thereby eliminating the source of particle shearing while still achieving adequate mixing through the recirculation process itself
Solution Approach 2:
The patent replaces the mechanical mixing system with a fluid dynamic approach. By designing the recirculation system with specific flow characteristics and tank geometry, the system uses fluid motion rather than mechanical agitation to maintain slurry homogeneity, thus avoiding particle damage while achieving the desired mixing effect
2Object-affected harmful factors
If mechanical mixers and preliminary mixing devices are eliminated, then slurry health is preserved, but the ability to maintain homogeneity over extended periods is compromised
Solution Approach 1:
The patent implements preliminary mixing through the recirculation system design itself, using optimized flow paths and tank geometry to ensure thorough mixing occurs during the recirculation process. This preliminary action within the recirculation loop maintains homogeneity without requiring additional mechanical mixers or tumblers, thereby preserving slurry health while extending the duration of homogeneous state
Solution Approach 2:
The patent employs dynamic recirculation flow patterns that adapt to maintain homogeneity over time. By optimizing the recirculation rate and flow distribution, the system creates continuous gentle agitation that prevents particle settling and maintains uniform distribution without the harsh effects of mechanical mixing, thus extending the period over which homogeneity is maintained
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus effectively recirculates fluids with minimal shear, preserving the health and homogeneity of semiconductor slurries, ensuring consistent particle distribution and reducing the risk of defects in wafers.
Implementation Method 1
a nozzle member with a helical groove that minimizes slurry shear by creating a 360-degree upward swirl
Data Source
AI summary
An apparatus for recirculating fluids in semiconductor systems. The apparatus including a base portion, an inlet portion coupled to a first end of the base portion, and a nozzle coupled to a second end of the base portion. The nozzle including a helical groove extending from a position near a nozzle base portion to a position near a tip of the nozzle portion. The helical groove extending from an exterior surface through the nozzle portion to an interior surface of the nozzle portion. Methods of using the apparatus in a semiconductor recirculation system are also disclosed.


