Helical Inductor Multilayer Structure Design

The patent merges the connection function into the insulator layer itself by creating a through-hole that directly connects adjacent inductive conductor layers. This eliminates the need for separate via-hole conductors, reducing device complexity while maintaining reliable electrical connection. The insulator layer with through-hole serves both as an insulating barrier and as a connection pathway.

The patent extracts the via-hole conductor from the structure, removing the unnecessary intermediate conductive element. By taking out the via-hole conductor and replacing it with a direct through-hole connection in the insulator layer, the patent reduces potential reliability issues associated with additional conductive paths while maintaining the required electrical connection.

The patent utilizes the vertical dimension (laminating direction) more efficiently by arranging inductive conductor layers at different heights within the same horizontal footprint. The through-hole connections enable current to flow vertically through multiple layers, creating a compact three-dimensional inductor structure that reduces the overall length in the laminating direction while maintaining electrical connection.

The patent implements a nested structure where multiple inductive conductor layers are positioned within a compact vertical space, with each layer partially overlapping or aligned with adjacent layers. This nesting arrangement allows the inductor to achieve its length through vertical stacking rather than horizontal extension, reducing the inductor length in the laminating direction.

The patent transitions from a two-dimensional planar inductor layout to a three-dimensional stacked configuration. By utilizing the vertical dimension through multiple laminated insulator layers with through-hole connections, the patent increases the effective inductor length without proportionally increasing the horizontal trace length, thereby reducing resistance and energy loss while maintaining reliable electrical connection.

The patent employs curved or spiral trace patterns within each inductive conductor layer, transforming straight-line current paths into curved paths that increase the effective inductor length within a compact area. This curvature increases inductance value while the through-hole connections maintain reliable electrical continuity between layers, reducing overall resistance.