Helical Lead Semiconductor Device for Mounting Height Adjustment
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Solution Overview
Problem
Existing semiconductor devices face challenges in accurately adjusting mounting height on assembly boards, leading to inconsistencies in detection sensitivity and complicated manufacturing due to fixed lead configurations and limited adjustability.
Innovation Solution
A semiconductor device with linear and helical leads extending from a resin or metal sealing body, where the helical leads wind around the linear lead, allowing for precise adjustment of mounting height by passing through specially shaped through-holes in the assembly board, enabling flexible positioning and vibration resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If straight lead pins are used with fixing members, then the semiconductor device can be fixed to the substrate, but the mounting height has large variation and cannot be controlled with high accuracy
Solution Approach 1:
The patent applies curvature to the lead structure by forming helical leads that wind around a central axis. This helical configuration allows the leads to engage with corresponding helical through-holes in the assembly board, providing mechanical guidance that constrains the mounting height to a precise value determined by the helical geometry, thereby resolving the contradiction between mounting height accuracy and structural complexity.
Solution Approach 2:
The patent changes the geometric parameters of the leads from straight to helical form. By controlling parameters such as helical pitch, diameter, and number of windings, the mounting height can be precisely adjusted and controlled. This parameter change enables high mounting height accuracy while maintaining a relatively simple overall structure.
2Adaptability or versatility
If bent lead portions are used to fix the semiconductor device, then the mounting height can be set to a predetermined height, but the position of each bent portion is fixed, requiring multiple product variants for different customers
Solution Approach 1:
The patent creates a universal semiconductor device design where the helical lead structure can accommodate different mounting height requirements through a single standardized lead configuration. The helical geometry serves multiple functions: providing mechanical support, enabling height adjustment, and ensuring proper positioning. This multi-functionality eliminates the need for multiple product variants, resolving the contradiction between adaptability and manufacturing complexity.
Solution Approach 2:
The helical lead structure introduces dynamic adjustability to the mounting system. Unlike fixed bent portions, the helical configuration allows for continuous adjustment of mounting height by modifying the engagement depth with the assembly board's through-holes, providing versatility without requiring different fixed configurations for different applications.
Data Source
AI summary
Provided is a semiconductor device enabling highly accurate adjustment of a mounting height at a time when the semiconductor device is mounted on an assembly board, and an electronic apparatus. A linear lead is extracted from a bottom surface of a cylindrical resin sealing body covering a semiconductor chip, and a plurality of helical leads are arranged so as to wind around the linear lead, to thereby form a multi-helical structure. The plurality of helical leads forming the multi-helical structure has the same pitch.