Helical UV Ozone Removal Unit for Semiconductor Substrates
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Solution Overview
Problem
Existing dissolved ozone removal methods using catalysts require frequent replacement due to limited catalyst lifetime, inefficiently removing high-concentration ozone from processing liquids in semiconductor manufacturing, which affects substrate cleanliness and production efficiency.
Innovation Solution
A dissolved ozone removal unit with a helical fluid channel and UV light source that exposes processing liquids to UV light, reducing ozone removal time and stabilizing the process for large volumes of high-concentration ozone water, utilizing a detachable UV lamp to prevent contamination and facilitate maintenance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If catalysts are used to remove dissolved ozone, then ozone removal is achieved, but the catalysts need to be periodically replaced due to fixed lifetime
Solution Approach 1:
The patent replaces the chemical catalyst system with a physical UV light-based decomposition system. The UV light source irradiates the processing liquid to directly decompose dissolved ozone into oxygen, eliminating the need for catalysts that require periodic replacement. This substitution of chemical means with physical means resolves the contradiction by providing reliable ozone removal without the lifetime limitation of catalysts.
Solution Approach 2:
The patent changes the operational parameters by using UV light intensity and exposure time instead of catalyst concentration and contact time. The control unit adjusts UV light parameters to maintain effective ozone removal throughout the processing liquid's circulation, providing sustained reliability without the degradation issues inherent in catalyst-based systems.
2Reliability
If conventional ozone removal methods are used, then dissolved ozone is removed, but the removal time is long and efficiency is low for high-concentration ozone water
Solution Approach 1:
The patent implements continuous circulation of the processing liquid through the UV irradiation chamber, ensuring that ozone removal action continues without interruption. The pump continuously circulates the liquid while UV light continuously decomposes ozone, maintaining constant removal effectiveness and reducing total processing time compared to batch methods.
Solution Approach 2:
The patent introduces a helical flow path that increases the residence time of processing liquid in the UV irradiation zone without increasing the physical size of the chamber. The helical configuration ensures thorough UV exposure throughout the liquid volume, achieving rapid and uniform ozone removal from high-concentration solutions efficiently.
3Productivity
If UV light source is directly contact with processing liquid, then ozone removal efficiency increases, but the UV light source gets contaminated and requires frequent maintenance
Solution Approach 1:
The patent segments the system into a UV light source chamber and a processing liquid circulation system, separated by transparent walls. The UV light source is isolated in its own chamber, preventing direct contact with processing liquid while still allowing effective irradiation through the transparent barrier. This segmentation maintains high removal efficiency while eliminating contamination and simplifying maintenance.
Solution Approach 2:
The patent introduces a transparent barrier (intermediary) between the UV light source and processing liquid. This barrier allows UV radiation to pass through effectively while preventing physical contact between the light source and liquid, thus maintaining productivity without the maintenance issues caused by direct contact contamination.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Significantly reduces ozone removal time, stabilizes the process for high-concentration ozone water, and extends the maintenance cycle of the UV light source, enhancing substrate cleaning efficiency and productivity in semiconductor manufacturing.
Implementation Method 1
a light source member that is mounted in the fluid channel providing member and that supplies UV light to the processing liquid
Data Source
AI summary
The inventive concept relates to a dissolved ozone removal unit, a substrate treating apparatus including the same, and a substrate treating method. The dissolved ozone removal unit includes a fluid channel providing member having a fluid channel through which a processing liquid passes and a light source member that is mounted in the fluid channel providing member and that supplies UV light to the processing liquid, and the fluid channel providing member includes a helical fluid channel configured such that the processing liquid is exposed to the UV light while helically moving around the light source member.