Hemi-Torus Metal-on-Elastomer LGA Interposer for Thermal Stress
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing Land Grid Array (LGA) interposers face challenges with reliability due to lateral thermal expansion stresses and lack of field replaceability, as they either become unreliable on larger areas or require soldering, limiting maintenance and upgrading costs in high-end computers.
Innovation Solution
The development of metal-on-elastomer LGA interposers with hemi-torus and other geometrically configured electric contacts, allowing for multiple points of electrical contact and reversible connections without soldering, which can accommodate non-uniformities and provide field replaceability by using elastomeric materials and metal strips to form continuous electrical paths.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If traditional ball grid arrays are used for larger areas, then connections can be made, but lateral thermal expansion stresses exceed the strength and reliability deteriorates
Solution Approach 1:
The patent changes the mechanical parameters of the contact structure by using a hemi-torus shape with multiple contact points instead of spherical balls, and employs elastomeric material properties to accommodate thermal expansion stresses that would otherwise exceed connection strength in traditional ball grid arrays on larger areas
Solution Approach 2:
The contact structure is segmented into multiple discrete contact points arranged circumferentially on the hemi-torus surface, allowing distributed stress accommodation across multiple points rather than concentrating stress at single ball contacts, thereby maintaining reliability over larger connection areas
2Strength
If column grid arrays are used to maintain strength under stress, then connections hold together, but soldering is required which eliminates field replaceability
Solution Approach 1:
The patent changes the joining mechanism from permanent soldering to reversible compression-based electrical contact through the elastomeric hemi-torus structure, maintaining adequate connection strength while enabling field replaceability and upgrades without requiring soldering operations
Solution Approach 2:
The elastomeric material provides dynamic compliance that allows the contact structure to maintain electrical connection through compression and elastic deformation, replacing the static rigid soldered joints with a dynamic system that accommodates thermal and mechanical stresses while remaining reversible
3Ease of repair
If metal-on-elastomer contacts are used to enable reversible connections, then field replaceability is achieved, but manufacturing complexity increases due to multiple contact points configuration
Solution Approach 1:
The patent employs a hemi-torus (curved, doughnut-like) geometry that naturally distributes multiple contact points along its circumferential surface, simplifying the manufacturing process compared to arranging discrete contacts on flat surfaces, while maintaining the reversible connection capability and field replaceability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances reliability and cost-effectiveness by enabling reversible connections, accommodating thermal stresses, and allowing for field replaceability, thus reducing maintenance and upgrading costs in high-end computer systems.
Implementation Method 1
a compliant contact consists of an elastomeric material structural element
Implementation Method 2
an elastomeric material structural element partially coated with an electrically conductive material, preferably such as a metal, so as to form the intended electrical contact
Data Source
AI summary
A method of producing a land grid array (LGA) interposer structure, including an electrically insulating carrier plane, and at least one interposer mounted on a first surface of said carrier plane. The interposer possesses a hemi-toroidal configuration in transverse cross-section and is constituted of a dielectric elastomeric material. A plurality of electrically-conductive elements are arranged about the surface of the at least one hemi-toroidal interposer and extend radically inwardly and downwardly from an uppermost end thereof into electrical contact with at least one component located on an opposite side of the electrically insulating carrier plane.


