Hemispherical Anvil Bonding for Stable Multi-Plate Nugget Formation
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Solution Overview
Problem
Existing bonding technologies face challenges in maintaining stable bonding strength for multiple metal plates, particularly when using resistance welding, and are limited by material compatibility and deformation issues that increase conductive contact areas, affecting the bonding process.
Innovation Solution
A bonding device with a hemispherical anvil having a partially conductive and partially insulated surface, combined with a shoulder component and a probe mechanism, to control current flow and prevent deformation, ensuring effective nugget formation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Force
If the plate assembly is pressed between the anvil and shoulder component during bonding, then the bonding pressure is sufficient to maintain contact, but the plate assembly bends and deforms which increases the conductive contact area between the plate assembly and anvil, making it difficult to generate a nugget for bonding
Solution Approach 1:
The anvil surface is segmented into two distinct functional zones: a conductive hemispherical surface for current flow and nugget generation, and an insulated receiving surface for stable plate support. This segmentation allows the anvil to simultaneously provide bonding pressure while preventing harmful deformation and maintaining controlled conductive contact area.
Solution Approach 2:
Different regions of the anvil surface are assigned different material properties: the hemispherical surface is made conductive to facilitate current flow and nugget formation, while the receiving surface is made insulated to prevent unwanted electrical contact and stabilize the plate assembly during pressing, thereby preventing deformation.
2Reliability
If the plate assembly deforms to increase conductive contact area with the anvil, then better electrical contact is achieved, but nugget generation becomes difficult and bonding effect deteriorates
Solution Approach 1:
The anvil surface is divided into conductive and insulated zones to separate the functions of electrical contact and mechanical support. The insulated receiving surface provides stable support without creating excessive conductive contact, while the conductive hemispherical surface ensures reliable current flow precisely where needed for nugget generation.
Solution Approach 2:
The insulated receiving surface acts as an intermediary between the plate assembly and the anvil body, providing mechanical support and stability while blocking unwanted electrical conduction. This allows reliable electrical contact through the intended path (shoulder component-plate-probe) without harmful alternative paths through deformation.
3Productivity
If resistance welding is used to bond three or more metal plates of different materials, then multiple plates can be bonded simultaneously, but stable bonding strength cannot be maintained for a long time
Solution Approach 1:
The bonding device changes the bonding parameters by combining resistance welding with friction stir welding in a sequential process. First, resistance welding provides initial bonding for multi-plate assembly, then friction stir welding reinforces the bonds with mechanical interlocking and metallurgical mixing, creating stable long-term bonding strength that resistance welding alone cannot achieve.
Solution Approach 2:
The bonding process creates a composite bonded structure where different bonding mechanisms (resistance welding and friction stir welding) work together on different interfaces or at different stages. This composite approach leverages the advantages of both methods: the efficiency of resistance welding for initial bonding and the stability of friction stir welding for long-term strength maintenance.
4Use of energy by moving object
If friction stir welding is used to bond metal plates, then energy efficiency is improved and gas generation is suppressed, but the method is limited to materials that can be effectively stirred and cannot bond three or more metal plates
Solution Approach 1:
The bonding device merges resistance welding and friction stir welding into a single integrated system. The resistance welding component enables bonding of three or more plates by creating initial bonds across multiple interfaces, while the friction stir welding component provides the energy-efficient, low-emission bonding mechanism for reinforced connections, combining the versatility of one method with the efficiency of the other.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The device prevents plate deformation and maintains a stable conductive contact area, enhancing bonding efficiency and reducing environmental impact by optimizing current flow paths.
Implementation Method 1
a hemispherical surface facing the first surface and being at least partially conductive... current flows through the plate assembly between the anvil and the shoulder component
Implementation Method 2
a receiving surface disposed at a position corresponding to the abutting surface of the shoulder component and being at least partially insulated
Implementation Method 3
a driving mechanism, configured to rotate the probe about a central axis intersecting the second surface... The friction stir welding consumes less electricity
Data Source
AI summary
A bonding device is used to bond a plate assembly including a first plate and a second plate and includes an anvil, a probe, a shoulder component, a driving mechanism, a power supply, and a control part. The anvil is configured to support a first surface of the plate assembly provided by the first plate. The probe is disposed at a position corresponding to the anvil to be opposite to a second surface of the plate assembly provided by the second plate. The shoulder component is disposed around the probe and has a via for the probe to pass through and an abutting surface for pressing the second surface. The anvil has a hemispherical surface facing the first surface and a receiving surface disposed at a position corresponding to the abutting surface. The anvil contacts the first surface with the hemispherical surface and the receiving surface.