Hemispherical Ground Plane Shorted Patch Antenna Size Reduction
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Solution Overview
Problem
Existing microstrip patch antennas are too large for handheld devices and small transponders in wireless communication systems, necessitating a reduction in both the radiating patch size and the supporting ground plane to accommodate limited device areas.
Innovation Solution
A Shorted Rectangular Microstrip Patch Antenna (SRMPA) design with a non-planar cylindrical ring around a shorted circular patch antenna, utilizing a high dielectric substrate to reduce the ground plane size from 0.6λ to 0.24λ, allowing the antenna to resonate at approximately ¼ the wavelength, resulting in a compact size with improved impedance match and radiation performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the ground plane size is reduced to fit handheld devices, then the antenna size is reduced, but the radiation performance and impedance match deteriorate
Solution Approach 1:
The patent transitions from a conventional planar ground plane to a three-dimensional hemispherical ground plane structure. This dimensional change allows the antenna to achieve compact size while maintaining adequate radiation performance through the curved surface geometry that provides better current distribution and impedance matching characteristics
Solution Approach 2:
The patent modifies the ground plane geometry from flat to hemispherical, changing the spatial parameters and surface curvature. This parameter change enables the antenna to resonate at approximately 1/4 wavelength while maintaining good impedance match and radiation patterns suitable for handheld devices
2Volume of moving object
If the ground plane size is reduced to fit handheld devices, then the antenna size is reduced, but the impedance match deteriorates
Solution Approach 1:
The hemispherical ground plane provides three-dimensional current distribution that improves impedance matching characteristics compared to planar structures, enabling better performance in compact antenna designs
3Device complexity
If a conventional planar ground plane is used, then the antenna structure is simple, but the coverage pattern is limited
Solution Approach 1:
The hemispherical ground plane creates a three-dimensional radiation structure that provides near-omnidirectional coverage patterns, significantly improving adaptability for handheld devices compared to planar configurations
Solution Approach 2:
The curved hemispherical geometry of the ground plane naturally produces superior radiation patterns with better omnidirectional coverage characteristics, enhancing the antenna's versatility for mobile communication applications
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The SRMPA achieves a drastic size reduction to approximately 1/12th the normal resonant length, providing a near hemispherical coverage pattern with improved cross-polarization response, enabling greater orientation diversity and efficient operation in wireless communication systems.
Implementation Method 1
utilizing a high dielectric substrate to reduce the ground plane size from 0.6λ to 0.24λ, allowing the antenna to resonate at approximately ¼ the wavelength
Implementation Method 2
A Shorted Rectangular Microstrip Patch Antenna (SRMPA) design with a non-planar cylindrical ring around a shorted circular patch antenna, allowing the antenna to resonate at approximately ¼ the wavelength
Data Source
AI summary
A reduced ground plane shorted microstrip antenna comprising: a metal ground plane having a radius of about 0.24λ; a substrate comprising a material having a dielectric constant of at least 4 disposed on top of said ground plane; a metal top layer including a radiating patch disposed on top of said substrate; a shorting wall disposed between said ground plane and said patch; and a power feedline connected to the metal top layer such that the top layer impedance and the feedline impedance match.