Hemispherical Soldering Tip for Stable Window Pane Connections
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Solution Overview
Problem
Conventional soldering tips for hand-soldering electrical connection elements on conductive structures, such as window panes, suffer from inefficient energy input and require precise positioning, leading to unstable connections and the need for additional fixing measures due to limited thermal conductivity and localized energy introduction.
Innovation Solution
A hemispherical soldering tip design for hand-held soldering irons, which ensures a larger contact area with the connection element, providing homogeneous energy input and simplifying the soldering process by allowing for reproducible contact regardless of the angle of the soldering iron, thus eliminating the need for separate fixing measures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional soldering tips with limited contact area are used, then precise positioning is required, but this leads to unstable connections and requires additional fixing measures
Solution Approach 1:
The soldering tip is designed with a hemispherical end section instead of a conventional flat or chisel shape. This curved surface provides a larger, more stable contact area with the connection element, ensuring reliable thermal transfer without requiring precise positioning. The spherical geometry naturally accommodates minor positioning variations while maintaining effective soldering contact.
2Power
If conventional soldering tips with localized energy input are used, then high energy input is required to melt solder, but this causes the connection element to float and shift position
Solution Approach 1:
The hemispherical contact surface distributes thermal energy over a larger area of the connection element, creating more uniform heating. This prevents localized overheating that would cause solder to rapidly melt and the connection element to float. The curved surface ensures consistent thermal contact throughout the soldering process, maintaining element stability.
Solution Approach 2:
The invention changes the geometric parameters of the soldering tip from a conventional shape to a hemispherical form. This parameter change increases the contact surface area, which fundamentally alters the thermal energy distribution pattern from localized to distributed, thereby preventing the connection element from floating on molten solder.
3Productivity
If conventional soldering tips are used, then high energy input is required to melt all solder, but this results in slow solidification and position shifting
Solution Approach 1:
The hemispherical tip design improves soldering efficiency by providing optimal thermal contact with the connection element. The curved surface ensures uniform heat distribution across the solder joint area, enabling complete solder melting with appropriate energy input. This uniform heating also promotes consistent and relatively rapid solidification, reducing the time the solder remains in a liquid state where the connection element could shift.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The hemispherical soldering tip achieves efficient and stable soldering with reduced energy input, preventing 'cold solder joints' and ensuring accurate positioning, making the process more economical and reliable, especially for manual soldering.
Implementation Method 1
The soldering tip is brought into contact with the connection element, whereupon it transfers the heat generated by the soldering iron through the connection element to the solder, which is thereby melted
Implementation Method 2
The hemispherical end section can be inserted into the recess, ensuring that a large area of the connection element—namely, the area surrounding the recess—is reproducibly brought into contact with the soldering tip. This results in efficient and homogeneous energy input, leading to uniform melting of the solder
Data Source
Figure 1~2
Figure 3
Figure 4~5
AI summary
The invention relates to a soldering tip (1) for a soldering iron (5), in particular for a hand-held soldering iron for soldering an electrical connection element (12) to an electroconductive structure (11) on a substrate (10), comprising a substantially hemispherical end portion (2). The invention further relates to a method for manufacturing a window comprising an electrical connection element by means of said soldering tip.