Hemispherical Tip Deformation Measuring Apparatus for Thin Film Thickness

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Solution Overview

Problem

Conventional methods such as universal testing machines and dynamic mechanical analyzers are ineffective in measuring the thickness direction properties of thin films, which are crucial for real-world electronic devices, and nano-indenters face challenges with surface roughness and high costs.

Innovation Solution

A deformation measuring apparatus with a hemispherical tip and a heating chamber that allows for precise measurement of thermal deformation force and thickness direction thermal expansion, using a position controlling portion to adjust the tip's contact with the specimen and a sensing portion to measure these properties.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If a universal testing machine or dynamic mechanical analyzer is used to measure thin film properties, then in-plane direction properties can be easily measured, but thickness direction properties cannot be effectively measured

Engineering Contradiction:

Improvethickness direction property measurementVSAvoidmeasurement direction capability

Core Design Contradiction:

Measurement precisionVSAdaptability or versatility

Solution Approach 1:

Instead of measuring the thin film in the conventional in-plane direction, the invention inverts the measurement approach by applying force in the thickness direction using a hemispherical tip that presses against the film surface, enabling measurement of out-of-plane properties that were previously inaccessible with standard equipment

Inventive Principle:

Principle #13The other way round (Inversion)

Solution Approach 2:

The invention transitions from two-dimensional in-plane measurement to three-dimensional thickness direction measurement by introducing a vertical pressing mechanism with a hemispherical tip, adding the thickness dimension to the measurement capability

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Measurement precision

If a nano-indenter is used to measure thickness direction properties, then measurement capability is improved, but surface roughness causes large deviations and measurement cost increases

Engineering Contradiction:

Improvethickness direction property measurementVSAvoidmeasurement consistency

Core Design Contradiction:

Measurement precisionVSReliability

Solution Approach 1:

The invention employs a hemispherical tip with a relatively large radius of curvature (0.1 μm to 5 mm) instead of a sharp nano-scale tip, which distributes the contact pressure over a larger area and reduces sensitivity to surface roughness variations, thereby improving measurement reliability and consistency

Inventive Principle:

Principle #14Spheroidality (Curvature)

Solution Approach 2:

The invention changes the critical parameter of tip radius from nano-scale (sharp tip) to micro-to-macro scale (hemispherical tip), fundamentally altering the contact mechanics to reduce surface roughness sensitivity while maintaining thickness direction measurement capability

Inventive Principle:

Principle #35Parameter changes

3Measurement precision

If a nano-indenter is used to measure thin film properties, then measurement capability is improved, but the cost for measurement increases

Engineering Contradiction:

Improvethickness direction property measurementVSAvoidmeasurement cost

Core Design Contradiction:

Measurement precisionVSEase of manufacture

Solution Approach 1:

The invention replaces the expensive nano-indenter with a simpler, more cost-effective hemispherical tip pressing mechanism that achieves the same measurement objective without requiring sophisticated nano-positioning equipment, significantly reducing measurement cost

Inventive Principle:

Principle #27Cheap short-living objects (Disposable)

Solution Approach 2:

The invention substitutes the complex mechanical nano-indentation system with a simpler thermal-mechanical pressing system that uses a heating chamber to control thermal expansion and a hemispherical tip to apply force, eliminating the need for expensive nano-positioning equipment

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables effective and cost-efficient measurement of thickness direction properties without damaging the specimen, providing accurate thermal deformation and stress data for thin films.

Implementation Method 1

a heating chamber in which the holder and the contact portion are disposed, and heating the specimen; and a sensing portion which measures at least one of a thermal deformation force of the specimen and a thickness direction thermal expansion of the specimen

Methodology Applied

Scientific EffectThermal expansion: Thermal Expansion

Data Source

PatentUS10712299B2Deformation measuring apparatus and method of evaluating deformation using thereof

Publication Date: 2020.07.14 SAMSUNG ELECTRONICS CO LTD

AI summary

A deformation measuring apparatus of a specimen includes: a holder which supports the specimen; a contact portion disposed facing the holder and including a hemispherical tip; a position controlling portion which adjusts a position of the contact portion along a thickness direction of the specimen to allow the hemispherical tip to be in contact with a surface of the specimen; a heating chamber which accommodates the holder and the contact portion and heating the specimen; and a sensing portion which measures at least one of a thermal deformation force (F) of the specimen or a thickness direction thermal expansion (Δh) of the specimen.