HEMT-Capacitor Mesa Isolation Layout for Independent Operation

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Solution Overview

Problem

The integration of high electron mobility transistors (HEMT) and capacitors in semiconductor devices requires effective isolation and structural design to maintain independent operation and optimal performance, which existing technologies have not adequately addressed.

Innovation Solution

A semiconductor device design featuring a substrate with HEMT and capacitor regions, mesa isolations, and a buffer layer, where the HEMT is isolated using a mesa isolation process and a hard mask, and a capacitor is integrated with a dielectric layer, allowing for independent operation and efficient electrical connections.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If mesa isolations are used to separate HEMT and capacitor regions, then interference between components is reduced, but manufacturing complexity increases due to additional fabrication steps

Engineering Contradiction:
Improveisolation effectivenessVSAvoidfabrication process complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The substrate is divided into distinct HEMT region and capacitor region by mesa isolations, physically separating the two components to reduce interference. The mesa isolation structure creates isolated islands for each device type, allowing independent operation and reducing electromagnetic coupling between HEMT and capacitor.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The buffer layer serves as an intermediary between the substrate and the active device regions. It provides a transition zone that facilitates the formation of mesa isolations and ensures proper electrical isolation while maintaining mechanical integrity of the substrate structure.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Reliability

If buffer layers are added between substrate and mesa isolations, then integration and isolation are improved, but manufacturing steps increase

Engineering Contradiction:
Improveintegration qualityVSAvoidfabrication simplicity
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The buffer layer is formed on the substrate before defining the HEMT and capacitor regions. This preliminary action prepares the substrate surface with appropriate electrical and mechanical properties, facilitating subsequent mesa isolation formation and ensuring proper isolation characteristics without requiring additional corrective steps later.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The buffer layer performs multiple functions: it provides electrical isolation between the substrate and active regions, serves as a mechanical support layer, facilitates thermal management, and enables proper formation of mesa isolations. This multi-functionality reduces the need for separate specialized layers.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Ease of manufacture

If hard mask is extended to capacitor region, then capacitor formation is facilitated, but HEMT region complexity increases

Engineering Contradiction:
Improvecapacitor fabrication easeVSAvoidHEMT structure complexity
Core Design Contradiction:
Ease of manufactureVSDevice complexity

Solution Approach 1:

The hard mask formation process for the HEMT region is merged with the capacitor region patterning. By extending the hard mask to cover both regions, the patent enables simultaneous definition of both HEMT and capacitor structures in a unified fabrication step, simplifying the overall manufacturing process.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The hard mask layer serves dual purposes: it defines the HEMT active region boundaries and simultaneously serves as the base structure for capacitor electrode formation. This multi-functional use of the hard mask eliminates the need for separate masking steps for capacitor fabrication.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Data Source

PatentUS20240290875A1High electron mobility transistor and method for fabricating the same
Publication Date: 2024.08.29 UNITED MICROELECTRONICS CORP
  • US20240290875A1 patent drawing
  • US20240290875A1 patent drawing
  • US20240290875A1 patent drawing

AI summary

A semiconductor device includes a substrate having a high electron mobility transistor (HEMT) region and a capacitor region, a first mesa isolation on the HEMT region, a HEMT on the first mesa isolation, a second mesa isolation on the capacitor region, and a capacitor on the second mesa isolation. The semiconductor device further includes buffer layer between the substrate, the first mesa isolation, and the second mesa isolation, in which bottom surfaces of the first mesa isolation and the second mesa isolation are coplanar.