HEMT Gate Structure for Stable Threshold Voltage Control

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Solution Overview

Problem

Existing semiconductor devices face challenges in maintaining stable electric characteristics and reliability, particularly in high-power applications, due to issues with threshold voltage control and reliability under varying temperatures and voltages.

Innovation Solution

The semiconductor device incorporates a channel layer, a barrier layer with a different energy band gap, and a gate electrode with a specific width configuration, including a narrower lower part and a wider upper part, along with a gate semiconductor layer, to induce a 2-dimensional electron gas and control its flow, enhancing reliability and stability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a conventional gate electrode structure is used, then the device structure is simple, but the threshold voltage control is unstable and reliability deteriorates under varying temperatures and voltages

Engineering Contradiction:
ImprovereliabilityVSAvoiddevice complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The gate electrode is divided into multiple segments along the channel width direction, with each segment having independently controllable width. This segmentation allows different portions of the gate to exert different electric field effects, enabling precise control of threshold voltage while maintaining device reliability under varying conditions.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Different regions of the gate electrode are designed with different widths to create localized electric field distributions. The first gate electrode portion has a different width than the second gate electrode portion, allowing tailored control of carrier flow in different channel regions to optimize threshold voltage stability and reliability.

Inventive Principle:
Principle #3Local quality

2Manufacturing precision

If the gate electrode width is uniform, then the manufacturing process is simpler, but the threshold voltage control precision is insufficient

Engineering Contradiction:
Improvethreshold voltage control precisionVSAvoidease of manufacture
Core Design Contradiction:
Manufacturing precisionVSEase of manufacture

Solution Approach 1:

The gate electrode structure employs asymmetric width distribution across different portions along the channel width direction. This asymmetric design creates non-uniform electric field distribution that enables precise threshold voltage control, with the first gate electrode portion having a specific width different from the second gate electrode portion.

Inventive Principle:
Principle #4Asymmetry

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The configuration ensures a normally off high electron mobility transistor (HEMT) with improved threshold voltage control, reducing the risk of gate failure and enhancing reliability under varying conditions.

Implementation Method 1

The barrier layer is positioned above the channel layer and includes a material having a different energy band gap than the channel layer

Methodology Applied
Scientific Effect2-dimensional electron gas induction:

Implementation Method 2

A width of the gate electrode is smaller than a width of the gate semiconductor layer at a junction surface of the gate electrode and the gate semiconductor layer

Methodology Applied
Scientific EffectElectric field control: Electric Field

Data Source

PatentUS20250221008A1Semiconductor device
Publication Date: 2025.07.03 SAMSUNG ELECTRONICS CO LTD
  • US20250221008A1 patent drawing
  • US20250221008A1 patent drawing
  • US20250221008A1 patent drawing

AI summary

A semiconductor device includes a channel layer, a barrier layer positioned above the channel layer and having a material with a different energy band gap than the channel layer, source and drain electrodes positioned on the channel layer, a gate electrode positioned above the barrier layer between the source and drain electrodes and a gate semiconductor layer positioned between the barrier layer and the gate electrode. The width of the gate electrode is smaller than the width of the gate semiconductor layer at a junction surface of the gate electrode and the gate semiconductor layer.