HEMT Insulating Layers for Breakdown Voltage

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Solution Overview

Problem

High electron mobility transistors (HEMTs) face challenges in high-frequency and high-voltage applications due to high source resistance and breakdown voltage issues, particularly with silicon-based devices, necessitating the use of III-V group semiconductor compounds like gallium nitride for improved performance.

Innovation Solution

A power electronic device structure incorporating a III-V group semiconductor compound with multiple insulating layers of varying dielectric constants to manage electric field distribution, including a high dielectric constant first insulating layer and a lower dielectric constant second insulating layer, is used to reduce electric field concentration and enhance breakdown voltage.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a single high dielectric constant insulating layer is used to increase breakdown voltage, then breakdown voltage is improved, but electric field concentration in certain regions may cause device destruction

Engineering Contradiction:
Improvebreakdown voltageVSAvoidelectric field concentration
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent applies local quality by using different dielectric constant materials in different spatial locations. A first insulating layer with high dielectric constant is placed in regions requiring high breakdown voltage, while a second insulating layer with low dielectric constant is placed in regions where electric field dispersion is needed. This spatial differentiation of material properties allows simultaneous optimization of breakdown voltage and electric field distribution throughout the device structure.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The patent employs composite materials by combining multiple insulating layers with different dielectric constants. The first insulating layer (high dielectric constant) and second insulating layer (low dielectric constant) are stacked together to form a composite insulating structure. This composite approach enables the device to benefit from both high breakdown voltage characteristics and effective electric field dispersion, resolving the contradiction between these two requirements.

Inventive Principle:
Principle #40Composite materials

2Speed

If III-V group semiconductor compounds are used to reduce source resistance and improve electron mobility, then electron mobility is improved, but device complexity increases

Engineering Contradiction:
Improveelectron mobilityVSAvoiddevice structure
Core Design Contradiction:
SpeedVSDevice complexity

Solution Approach 1:

The patent applies parameter changes by transitioning from silicon-based semiconductors to III-V group semiconductor compounds. This material substitution fundamentally changes key parameters including carrier mobility, band gap, and effective mass. The III-V group compounds provide superior electron mobility and saturation velocity, enabling high-frequency and high-power applications while the associated device complexity is managed through the insulating layer structure design.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The structure effectively disperses electric fields and increases breakdown voltage, preventing device destruction and improving high-output, high-frequency performance of HEMTs.

Implementation Method 1

The first insulating layer has a first dielectric constant. The second insulating layer has a second dielectric constant less than the first dielectric constant.

Methodology Applied
Scientific EffectDielectric constant: Dielectric Permittivity

Data Source

PatentUS8835985B2Power electronic device and method of manufacturing the same
Publication Date: 2014.09.16 SAMSUNG ELECTRONICS CO LTD
  • US8835985B2 patent drawing
  • US8835985B2 patent drawing
  • US8835985B2 patent drawing

AI summary

According to an example embodiment, a power electronic device includes a first semiconductor layer, a second semiconductor layer on a first surface of the first semiconductor layer, and a source, a drain, and a gate on the second semiconductor layer. The source, drain and gate are separate from one another. The power electronic device further includes a 2-dimensional electron gas (2DEG) region at an interface between the first semiconductor layer and the second semiconductor layer, a first insulating layer on the gate and a second insulating layer adjacent to the first insulating layer. The first insulating layer has a first dielectric constant and the second insulating layer has a second dielectric constant less than the first dielectric constant.