Heptagonal Ring Compound Edge Bead Removal Composition
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Solution Overview
Problem
The semiconductor industry faces challenges in removing edge beads from metal-containing resists during photolithographic processes, leading to pattern defects and contamination, as existing methods fail to effectively solubilize and remove these beads without leaving residues.
Innovation Solution
A composition comprising an organic solvent and a heptagonal ring compound substituted with at least one hydroxyl group is used to remove edge beads from metal-containing resists, which includes coating the substrate with this composition, drying, and then exposing and developing to form a resist pattern, thereby reducing metal-based contamination and facilitating the processing of smaller features.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional thinner compositions are used for edge bead removal, then the photoresist can be removed from edge and rear surfaces, but metal-based contamination remains and resist residue is generated
Solution Approach 1:
The patent modifies the chemical composition parameters of the thinner by incorporating specific metal complexing agents that selectively bind to metal ions in the edge bead material. This chemical parameter change enables effective metal removal without affecting the underlying substrate or leaving harmful residues
Solution Approach 2:
The patent introduces metal complexing agents as intermediary substances that mediate between the thinner and metal-containing resist. These agents form soluble complexes with metal ions, acting as a bridge that enables metal removal while preventing direct contamination of the substrate
2Ease of manufacture
If conventional thinner compositions are used for edge bead removal, then the photoresist can be removed from edge and rear surfaces, but resist residue is generated causing pattern defects
Solution Approach 1:
The patent optimizes the solvent system parameters by selecting specific organic solvents with appropriate polarity and boiling point characteristics. This enables complete dissolution of resist materials while ensuring thorough evaporation without residue, maintaining pattern accuracy
Solution Approach 2:
The patent creates a composite thinner composition combining multiple functional components: metal complexing agents, resist solvents, and volatility control agents. This composite formulation achieves simultaneous metal removal, complete resist dissolution, and residue-free drying
3Area of stationary object
If the photoresist is coated on the edge and rear surface of the substrate, then complete substrate coverage is achieved, but indentation and pattern defects occur in subsequent processes
Solution Approach 1:
The patent performs edge bead removal as a preliminary step before main patterning processes. By removing excess resist from edge and rear surfaces in advance, subsequent etching and ion implantation processes can proceed without indentation or pattern defects
Solution Approach 2:
The patent extracts and removes the problematic edge bead material from the substrate using a specialized thinner composition. This extraction eliminates the source of future pattern defects while preserving the functional photoresist pattern on the main substrate area
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition effectively removes edge beads and reduces metal-based contamination, ensuring accurate pattern formation and satisfying the requirements for smaller feature sizes in semiconductor processing.
Implementation Method 1
a composition for removing edge beads from metal-containing resists... includes an organic solvent and a heptagonal ring compound substituted with at least one hydroxyl group
Data Source
AI summary
A composition for removing edge beads from a metal-containing resist, and a method of forming patterns including step of removing edge beads using the same are provided. The composition for removing edge beads from a metal-containing resist includes an organic solvent, and a heptagonal ring compound substituted with at least one hydroxyl group (—OH). The heptagonal ring compound has at least two double bonds in the ring.