Heptagonal Transfer Chamber Layout for Smaller Wafer Tool Footprint
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Solution Overview
Problem
The existing semiconductor processing tools have a large footprint due to the use of multiple transfer chambers and vias, which occupies valuable space in fabrication facilities and limits productivity.
Innovation Solution
A semiconductor processing system with a single transfer chamber designed to attach to four processing chambers and two auxiliary chambers, along with a load lock, where the transfer chamber has seven facets - four larger for processing chambers and three smaller for auxiliary chambers and a load lock, allowing for a more compact configuration and efficient wafer processing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple transfer chambers are used to perform pre-clean and epitaxial growth deposition, then processing chamber capability is maintained, but the footprint of the processing tool becomes large
Solution Approach 1:
The patent combines two separate transfer chambers into a single transfer chamber that serves both pre-clean and epitaxial growth deposition functions. The single transfer chamber is configured with multiple facets to connect to different processing chambers, eliminating the need for separate transfer chambers and reducing the overall tool footprint while maintaining full processing capability.
Solution Approach 2:
The single transfer chamber is designed as a multi-functional component that can interface with multiple types of processing chambers (pre-clean and epitaxial growth). By making the transfer chamber universal rather than specialized for a single function, the system achieves the same processing capabilities with reduced hardware and smaller footprint.
2Area of stationary object
If a single transfer chamber is used to reduce footprint, then space efficiency improves, but the complexity of facet configuration increases
Solution Approach 1:
The single transfer chamber is segmented into multiple facets, each designed for specific connections. By dividing the transfer chamber into distinct facial segments (with four first facets for processing chambers and three second facets for auxiliary chambers), the complex multi-functional requirements are broken down into manageable, specialized connection points that simplify overall system integration.
Data Source
AI summary
A substrate processing system includes a factory interface, a transfer chamber of heptagonal shape and including four first facets and three second facets, each having a width that is narrower than that of each of the four first facets. A processing chamber is attached to one of the four first facets. A first auxiliary chamber attached to a first of the three second facets and is smaller than the first processing chamber. A load lock is attached to a second of the three second facets and to the factory interface. A second auxiliary chamber is attached to a third of the three second facets. The load lock is attached to the transfer chamber between the first and second auxiliary chambers. A robot is attached to a bottom of the transfer chamber and adapted to transfer substrates to/from the first processing chamber, the first auxiliary chamber, and the load lock.