Hermaphroditic Connector Assembly for High-Speed Signal Integrity
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing copper-based chip-to-chip interconnections suffer from substantial printed circuit board signal losses and lack flexibility, leading to inefficiencies in high-data rate applications.
Innovation Solution
The development of hermaphroditic connectors with T-shaped engagement features, U-shaped shields, and conductive structures that provide electromagnetic protection and structural support, allowing for high-speed signal transmission while reducing crosstalk and impedance variations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If copper-based interconnections are used in traditional connectors, then electrical signals can be transmitted, but substantial PCB signal losses occur and flexibility is reduced
Solution Approach 1:
The patent replaces traditional copper-based electrical interconnections with magnetic field-based wireless power and data transmission. The first device generates a magnetic field that couples with the second device, eliminating the need for physical copper traces on PCBs and thereby reducing signal losses while increasing design flexibility.
Solution Approach 2:
The patent introduces a magnetic field as an intermediary medium to transfer power and data between devices. This magnetic coupling mechanism serves as a mediator that replaces direct electrical contact through copper conductors, reducing resistive losses and enabling greater adaptability in connector design.
2Reliability
If traditional connectors are used, then connections can be established, but space requirements are excessive and cost increases
Solution Approach 1:
The patent extracts the essential function of electrical connection and replaces it with magnetic field coupling. By removing the need for extensive copper traces, large connector housings, and complex PCB routing, the design achieves reliable power and data transmission in a significantly reduced space footprint.
Solution Approach 2:
The patent changes the fundamental operating parameter from electrical conduction through copper to magnetic field induction. This parameter change enables the same connection reliability to be achieved with much smaller physical dimensions and lower material costs.
3Reliability
If copper traces on PCB are used, then electrical signals can be routed, but signal integrity deteriorates due to losses
Solution Approach 1:
The patent substitutes electromagnetic induction through magnetic fields for electrical conduction through copper PCB traces. This replacement eliminates resistive losses, inductance effects, and capacitance effects associated with traditional PCB routing, thereby maintaining signal integrity while reducing energy loss.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The connectors enable high-density, high-bandwidth connections with reduced signal losses and lower costs by minimizing crosstalk and maintaining signal integrity, while using less space than traditional connectors.
Implementation Method 1
Each shield may be further configured to electromagnetically protect high-speed, differential electrical signals being transmitted by terminals
Implementation Method 2
configured as an electrical ground and may be further configured to electromagnetically protect high-speed, differential electrical signals
Data Source
AI summary
High-speed, hermaphroditic electrical connectors may be connected to form a hermaphroditic connector assembly that uses less space than existing connector assemblies. A housing can provide a first and second engagement feature that are intended to engage each other so that when two such connectors are rotated 180 degrees the engagement features allow two such connectors to mate together. Cables can be connected directly to the terminals so as to provide for improved electrical performance.