Hermetic Electronic Component Sealing for Moisture and Thermal Stress
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Solution Overview
Problem
Existing electronic components with humidity-sensitive functional parts face moisture ingress issues due to gaps between the frame, glass element, and support element, leading to functional loss or deterioration.
Innovation Solution
An electronic component design featuring a glass plate with a sealing metal layer directly connected to the glass plate, a cover part with a lower water vapor transmission rate than the filling resin, and a via conductor through holes for electrical connectivity, which reduces moisture entry and thermal stress by allowing the sealing metal layer to expand with the resin.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a frame and glass element structure is used to seal the functional part, then the functional part is protected from moisture, but gaps between components allow moisture entry leading to functional loss
Solution Approach 1:
A sealing metal layer is introduced as an intermediary component between the first glass plate and the cover part. This sealing metal layer directly connects to the glass plate and forms an airtight seal, eliminating gaps that would otherwise allow moisture to penetrate between the frame and glass element interfaces.
Solution Approach 2:
The sealing structure combines multiple materials with complementary properties: glass plates provide chemical inertness and moisture resistance, while the sealing metal layer provides ductility and conformability to create an airtight barrier. The filling resin part with specific water vapor transmission rate characteristics complements this by providing additional moisture protection while allowing thermal expansion.
2Reliability
If a rigid sealing structure is used to prevent moisture entry, then moisture protection is improved, but thermal expansion stress causes structural failure
Solution Approach 1:
The water vapor transmission rate of the filling resin part is specifically controlled to be higher than that of the cover part, creating a gradient that allows moisture vapor to be absorbed by the resin while maintaining the airtight seal. This parameter optimization enables the structure to accommodate thermal expansion without compromising moisture protection.
Solution Approach 2:
The sealing metal layer is specifically selected for its thermal expansion characteristics that match or complement the glass plate and cover part. This allows the sealing structure to expand and contract uniformly with temperature changes, preventing stress concentration and structural failure while maintaining the airtight seal.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively suppresses moisture entry into the functional part while accommodating thermal expansion, thereby enhancing the reliability and longevity of humidity-sensitive electronic components.
Implementation Method 1
a sealing metal layer that is directly connected to the first glass plate and connects together the first glass plate and the cover part so as to airtightly seal an internal space
Implementation Method 2
a water vapor transmission rate of the cover part is less than or equal to one-tenth of a water vapor transmission rate of the filling resin part having a same film thickness
Implementation Method 3
reduces moisture entry and thermal stress by allowing the sealing metal layer to expand with the resin
Data Source
AI summary
An electronic component that includes: a sealing body having a first plate, a cover part spaced form the first plate, and a sealing metal layer; a functional part spaced from the first plate and in an airtight internal space of the sealing body; a filling resin part filling a space between the sealing body and the functional part; and a via conductor in a first through hole extending through the first plate and in a second through hole extending through the filling resin part and communicating with the first through hole, the via conductor being electrically connected to a pair of electrodes of the functional part. A water vapor transmission rate of the cover part is less than or equal to one-tenth of a water vapor transmission rate of the filling resin part having the same film thickness, or the cover part is made of glass or metal.