Hermetic Containment Device Using Cold Welded PCB Substrates

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Solution Overview

Problem

Conventional implantable medical devices face challenges with hermeticity, complexity, and volume due to multiple housing components and feedthrough pins, leading to potential leak points, high manufacturing costs, and increased device size.

Innovation Solution

The solution involves a containment device with a microchip element and biocompatible electronic printed circuit boards (PCBs) secured by a housing ring, eliminating the need for costly feedthroughs and metal housings, using a silicon substrate bonded to a polymer or ceramic primary substrate for reservoir formation, and employing compression cold welding for hermetic sealing.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional feedthrough pins are used to provide electrical connections, then electrical connectivity is achieved, but the number of potential leak points increases and hermeticity deteriorates

Engineering Contradiction:

ImprovehermeticityVSAvoidpin count

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent merges the electrical connection function and hermetic sealing function into a single integrated feedthrough structure. The feedthrough pin is metallurgically bonded directly to the housing, combining the electrical conduit and sealing barrier into one component, thereby eliminating separate sealing elements and reducing potential leak paths while maintaining electrical connectivity.

Inventive Principle:

Principle #5Merging (Combining)

2Ease of operation

If multiple discrete housing components are used, then assembly flexibility is improved, but the overall device volume increases

Engineering Contradiction:

Improveassembly flexibilityVSAvoiddevice volume

Core Design Contradiction:

Ease of operationVSVolume of moving object

Solution Approach 1:

The patent merges multiple discrete housing components into a single integrated housing structure. The housing is formed as one piece that incorporates both the sealing barrier and the electrical feedthrough connections, eliminating the need for separate end caps, flanges, and mounting brackets, thereby reducing overall device volume while maintaining assembly flexibility through modular component integration.

Inventive Principle:

Principle #5Merging (Combining)

3Adaptability or versatility

If conventional metal housings with surface-mounted antennas are used, then radio frequency transmission is achieved, but the device volume and complexity increase

Engineering Contradiction:

Improveradio frequency capabilityVSAvoiddevice volume

Core Design Contradiction:

Adaptability or versatilityVSVolume of moving object

Solution Approach 1:

The patent makes the housing structure multi-functional by integrating both the hermetic sealing barrier and the radio frequency antenna functions into a single component. The housing serves dual purposes: protecting internal components from body fluids and providing wireless communication capability, thereby eliminating the need for separate antenna components and reducing overall device volume.

Inventive Principle:

Principle #6Universality (Multi-functionality)

4Adaptability or versatility

If high pin count feedthroughs are used, then electrical connectivity is improved, but manufacturing cost increases

Engineering Contradiction:

Improveelectrical connectivityVSAvoidmanufacturing cost

Core Design Contradiction:

Adaptability or versatilityVSEase of manufacture

Solution Approach 1:

The patent replaces complex mechanical assembly processes with metallurgical bonding. Instead of mechanically assembling multiple feedthrough pins into the housing, the feedthrough is metallurgically bonded directly to the housing structure, simplifying the manufacturing process, reducing assembly steps, and lowering manufacturing costs while maintaining high electrical connectivity.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design enhances hermeticity, reduces device volume, simplifies assembly, and lowers manufacturing costs by eliminating numerous feedthrough pins and electrical connections, while allowing for controlled release of reservoir contents.

Implementation Method 1

employing compression cold welding for hermetic sealing

Methodology Applied

Scientific EffectCompression cold welding: Welding

Data Source

PatentEP2747642B1Space-efficient containment devices and method of making same

Publication Date: 2021.04.28 MICROCHIPS BIOTECH INC

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AI summary

Containment devices and methods of manufacture and assembl y are provided, in an embodiment, the device includes at least one microchip element, which includes a containment reservoir that can be electrically activated to open, and a first electronic printed circuit board (PCB) which comprises a biocompatible substrate. The first PCB may have a first side on which one or more electronic compooents are fixed and an opposed second side on which the microchip element is fixed in electrical connection to the one or more electronic components. The device may further include a second PCB and a housing ring securing the first PCB together with the second PCB, The microchip element may Include a plurality of containment reservoirs, which may be microreservoirs, and/or which may contain a drag formulation or a sensor element.