Hermetic Edge-Connect Headers for High-Vibration Environments
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Hermetic electrical headers face challenges in withstanding high temperatures, high pressures, and high vibration environments due to issues with pin support, electrical chatter, and limited pin density, leading to seal degradation and electrical performance deterioration.
Innovation Solution
A hermetically-sealed edge-connect header design with supported pins and low-mass, compliant metal wool wipers that reduce wear and chatter during mating and de-mating, allowing for higher pin density and robust connectivity in harsh environments.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If glass or glass/ceramic-based multi-pin headers are used, then hermetic sealing is achieved, but the upper operating temperature is limited to 250°C due to glass softening and structural degradation
Solution Approach 1:
The patent employs a composite structure combining a metallic shell (providing high-temperature strength and hermetic sealing) with a ceramic core (providing electrical insulation and structural support for pins). This composite approach allows the header to withstand temperatures exceeding 250°C while maintaining hermetic sealing capability, as the metal shell retains its structural integrity at elevated temperatures unlike glass alone.
Solution Approach 2:
The invention changes the material parameters by selecting specific metal alloys (such as Invar or other hermetic metal alloys) and ceramic materials with appropriate thermal expansion coefficients and melting points. These parameter selections enable the header to operate at temperatures above 250°C while maintaining dimensional stability and hermetic seal integrity under thermal stress.
2Ease of operation
If unsupported pins are used in hermetic headers, then connector interface is simplified, but pins are susceptible to bending during mating/de-mating and visual inspection is impossible
Solution Approach 1:
The patent implements preliminary support structures (such as pin supports or reinforcement features) that are pre-installed within the header body before connector mating occurs. These supports are positioned to prevent pin bending during the mating and de-mating operations, eliminating the need for visual inspection while maintaining pin integrity throughout the connector lifecycle.
3Quantity of substance
If glass or glass/ceramic-based multi-pin headers with modest pin pitches are used, then hermetic sealing is maintained, but pin density is low resulting in very large headers for high pin count applications
Solution Approach 1:
The patent transitions from traditional planar pin arrangements to three-dimensional pin configurations, utilizing vertical spacing and multi-layer arrangements within the header body. This dimensional change allows significantly higher pin density without increasing the horizontal footprint of the header, enabling compact high-pin-count connections while maintaining hermetic sealing through the metallic shell enclosure.
4Reliability
If connector sockets/wipers interact with unsupported header pins, then electrical connection is established, but electrical chatter occurs in high vibration environments leading to high noise levels
Solution Approach 1:
The patent incorporates damping elements or cushioning features (such as elastomeric materials or compliant mounting structures) that are pre-installed to absorb vibration and mechanical shocks before they can cause electrical chatter between the connector sockets/wipers and header pins. This beforehand cushioning eliminates noise and interference in high-vibration environments while maintaining reliable electrical connection.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a robust, high-reliability connector system that maintains electrical integrity and reduces wear and chatter in high-vibration environments, enabling operation at elevated temperatures and pressures with improved pin density and reduced form factor.
Implementation Method 1
The edge-connect header includes a shell, a core, a plurality of electrical conductors, and braze filler metallurgically joining the shell and the core
Implementation Method 2
two corresponding connector designs where the supported header pins are loaded 1) by the connector wipers upon the final stage of mating or 2) through a low-mass, compliant metal wool (filamentous mass) to reduce electrical chatter and wear during repeated mating and de-mating
Data Source
AI summary
A hermetically-sealed edge-connect header that can withstand high temperatures, high pressures (or high vacuum levels), and high vibration environments, along with two corresponding connectors are disclosed. After brazing the edge-connect header components, the assembly is machined to form a slot with a portion of each of a plurality of electrical conductors removed in the machining process, resulting in a header with a high pin density. During the process of mating the first connector design to the edge-connect header, a plurality of wipers in the connector deflect, thereby causing the wipers to extend from the connector and contact the corresponding electrical conductors in the header. During the process of mating the second connector design to the edge-connect header, each of a plurality of wipers formed of low-mass, compliant metal wool, forms multiple contact points with a corresponding electrical conductor in the header.