Hermetic Feedthrough Using Noble Metal Wire in Ceramic Body
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Solution Overview
Problem
There is a need for a feedthrough in ceramic bodies that provides a reliable hermetic seal to prevent moisture and gases from penetrating and damaging electronic circuitry, allows for multiple electrical pathways in a small area, uses biocompatible materials, and is fabricated using a simplified technique.
Innovation Solution
A feedthrough assembly is created by inserting a wire made of platinum, palladium, rhodium, iridium, or osmium, or their alloys through a green ceramic body, which is then fired to form a hermetic seal, allowing for the construction of multiple electrical pathways while ensuring biocompatibility and moisture resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If discrete multi-component assemblies (metal, glass, ceramic) are used to create feedthroughs in ceramic bodies, then hermetic sealing and electrical continuity can be achieved, but the device complexity and manufacturing cost increase significantly
Solution Approach 1:
The patent combines the electrical conductor and hermetic seal functions into a single integrated wire structure. The metal wire serves dual purposes: providing electrical continuity through the ceramic body and forming a hermetic seal at the interface, eliminating the need for separate metal, glass, and ceramic components that were previously required.
Solution Approach 2:
The metal wire performs multiple functions simultaneously: it acts as an electrical conductor, a hermetic seal, and a structural element. This multi-functional approach replaces the specialized discrete components (conductive elements, sealants, and mounting structures) that were traditionally required.
2Reliability
If discrete multi-component assemblies are used for feedthroughs, then hermetic barriers can be formed, but manufacturing cost and fabrication complexity increase
Solution Approach 1:
The invention merges the barrier function with the conductor into a single wire component. The metal wire inherently provides both moisture barrier properties through its hermetic seal and electrical conductivity, simplifying the manufacturing process by reducing the number of assembly steps and components.
Solution Approach 2:
The metal wire is pre-formed with the appropriate dimensions and properties before insertion into the ceramic body. This preliminary preparation allows for simpler integration during the firing process, as the wire is already configured to provide both sealing and conduction functions without requiring complex post-assembly operations.
3Productivity
If high density multi-conductor configurations are required, then electrical pathway density increases, but the complexity of assembling discrete feedthroughs becomes prohibitive
Solution Approach 1:
The patent enables high-density multi-conductor configurations by using multiple thin metal wires that can be closely spaced within the ceramic body. Each wire independently provides both sealing and conduction, allowing for compact arrangements that would be impossible with bulky discrete feedthrough assemblies.
Solution Approach 2:
The invention transitions from two-dimensional surface mounting of discrete feedthroughs to three-dimensional integration of wires within the ceramic body. This allows conductors to be positioned in multiple spatial dimensions, enabling higher density configurations and more flexible routing options.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves a high success rate of hermetic seals, maintaining integrity even under thermal shock, and supports the use of biocompatible materials for implantable devices, effectively addressing the need for reliable and efficient moisture-resistant feedthroughs in ceramic bodies.
Implementation Method 1
During the firing process, the polymer binder material is driven off and/or decomposed at elevated temperature, allowing the ceramic particles to closer approximate each other and become sintered or fused.
Implementation Method 2
the polymer binder material is driven off and/or decomposed at elevated temperature
Implementation Method 3
The wire directly contacts the ceramic body to form a substantially hermetic seal between the ceramic body and the wire
Data Source
AI summary
A wire extends through a ceramic body. The wire comprises a material selected from the group consisting of platinum, palladium, rhodium, iridium, osmium and alloys of platinum, palladium, rhodium, iridium, and osmium. The wire directly contacts the ceramic body to form a substantially hermetic seal between the ceramic body and the wire.