Hermetic IMD Enclosure With Integrated Antenna for Larger Power Source
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Solution Overview
Problem
The size constraints of implantable medical devices (IMDs) limit the power supply, which in turn restricts the functionality that can be incorporated, and the use of a header for signal transmission further reduces available space for the power source.
Innovation Solution
A hermetically sealed IMD design using a non-conductive enclosure and integrated antenna within the housing, eliminating the need for a header and allowing for a larger power source by using a non-conductive material like liquid crystal polymer or epoxy, with electrodes and connector traces secured by frames, and a hermetic seal.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If a header is used for signal transmission, then communication functionality is achieved, but the power source size is reduced
Solution Approach 1:
The patent merges the antenna structure directly into the housing, eliminating the separate header component. The housing serves dual purposes as both structural enclosure and antenna support, integrating functions that were previously separated into distinct components.
Solution Approach 2:
The patent extracts and removes the header component from the device architecture. By eliminating the header, the design achieves more efficient space utilization, allowing the power source to occupy the space previously taken by the header while maintaining communication functionality through the integrated antenna in the housing.
2Use of energy by moving object
If the device size is increased to accommodate larger power source, then the overall device dimensions increase, but the power supply capacity is improved
Solution Approach 1:
The patent optimizes the antenna configuration by arranging portions parallel and perpendicular to the longitudinal axis, utilizing three-dimensional space efficiently. This dimensional arrangement allows the antenna to achieve required radiation patterns without increasing the overall device volume, thereby accommodating a larger power source within the same footprint.
3Volume of moving object
If non-conductive material is used for the enclosure, then the power source size can be increased, but the manufacturing complexity increases
Solution Approach 1:
The patent employs composite material construction where the housing comprises both conductive and non-conductive elements. The non-conductive enclosure material is combined with conductive traces and antenna structures, creating a multi-material assembly that provides both electrical isolation and electromagnetic radiation functionality while managing manufacturing complexity through integrated design.
Data Source
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Figure 3A~3B
AI summary
Embodiments of the present disclosure relate to implantable medical devices (IMDs). In an exemplary embodiment, an IMD comprises a power source and a housing enclosing the power source. The housing comprises a first side and a second side extending along a longitudinal axis between a first end and a second end, wherein the first side is opposite the second side and the first end is opposite the second end, and wherein a first distance between the first and second ends is greater than a second distance the first and second sides. The IMD further comprises a printed circuit board arranged on the first side of the base and conductively coupled to the power source. The IMD also comprises a non-conductive enclosure arranged over the printed circuit board and hermetically sealing the printed circuit board, the non-conductive enclosure comprising an outer surface. And, the IMD comprises first and second electrodes arranged on the outer surface of the non-conductive enclosure, wherein the first external electrode is coupled to the printed circuit board by a first trace and the second external electrode is coupled to the printed circuit board by a second trace.