Hermetic LED Color-Converting Substrate with Laser-Sealed QD Cavity

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Solution Overview

Problem

Conventional methods for fabricating quantum dot (QD)-LEDs face high manufacturing costs due to the need for repeated barrier layer coating and surface etching, which do not effectively protect QDs from external moisture, limiting their lifespan and color uniformity.

Innovation Solution

A color-converting substrate for LEDs is developed, comprising a sheet with a hole containing QDs, sealed by a sealing material between two substrates, allowing laser sealing, using materials like anodized aluminum foil or 42-nickel alloy sheets and frit glass, to create a hermetically sealed environment.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional methods use repeated barrier layer coating to protect QDs, then manufacturing cost increases, but protection effectiveness remains limited

Engineering Contradiction:
Improveprotection effectivenessVSAvoidmanufacturing cost
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The patent extracts the QDs from the bulk polymer matrix and places them in a hollow cavity, separating the QDs from direct contact with moisture and oxygen sources. This extraction approach provides inherent protection without requiring multiple barrier coating layers, thus reducing manufacturing cost while maintaining or improving protection effectiveness.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The hollow cavity acts as an intermediary barrier between the QDs and the external environment. By enclosing QDs in this isolated cavity space, the patent creates a protective interface that prevents direct exposure to harmful external factors, achieving effective protection with simpler manufacturing processes.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Reliability

If conventional methods use surface etching of glass, then manufacturing cost increases, but QD protection is still insufficient

Engineering Contradiction:
ImproveQD protectionVSAvoidmanufacturing cost
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

Instead of modifying the glass surface through etching, the patent extracts the QDs and places them in a hollow cavity within the glass substrate. This approach protects QDs by isolating them in a cavity rather than relying on surface etching, eliminating the need for costly etching processes while providing superior protection.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The patent inverts the conventional approach by not etching the glass surface to hold QDs, but instead creating a hollow cavity within the glass that encloses the QDs. This inversion of the etching concept provides better protection without the associated manufacturing costs and limitations.

Inventive Principle:
Principle #13The other way round (Inversion)

3Reliability

If thin film glass is used with conventional etching, then manufacturing becomes difficult, but protection requirements remain the same

Engineering Contradiction:
Improveprotection requirementVSAvoidmanufacturing difficulty
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The patent extracts QDs into a hollow cavity in the thin film glass, providing effective protection without requiring surface etching. This approach makes thin film glass manufacturing feasible by eliminating the etching step that would be particularly difficult and costly for thin films, while still achieving the necessary protection levels.

Inventive Principle:
Principle #2Taking out (Extraction)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method reduces manufacturing costs by omitting multilayer coating and etching processes, ensuring complete protection of QDs and enhancing the lifespan of the LED package while maintaining color uniformity.

Implementation Method 1

a color-converting substrate for a light-emitting diode (LED), the color-converting substrate being able to be hermetically sealed to entirely protect quantum dots (QDs) accommodated therein from the outside

Methodology Applied
Scientific EffectHermetic sealing:

Implementation Method 2

the sheet is formed from a material allowing laser sealing to be performed between the sealing material, the first substrate, and the second substrate

Methodology Applied
Scientific EffectLaser absorption: Absorption (EM radiation)

Data Source

PatentUS9893245B2Color-converting substrate for light-emitting diode and method for producing same
Publication Date: 2018.02.13 SAMSUNG CORNING PRECISION MATERIALS CO LTD
  • US9893245B2 patent drawing
  • US9893245B2 patent drawing
  • US9893245B2 patent drawing

AI summary

The present invention relates to a color-converting substrate of a light-emitting diode and a method for producing same, and more specifically to a color-converting substrate of a light-emitting diode capable of completely protecting the quantum dots (QD) supported in the interior from the exterior as hermetic sealing is possible, and a method for producing the color-converting substrate. To that end, provided are a color-conversion substrate of a light-emitting diode and a method for producing the color-conversion substrate, the color-conversion substrate of a light-emitting diode comprising: a first substrate and a second substrate arranged facing each other on a light-emitting diode; a sheet, having a hole, arranged in between the first and second substrates; QDs filling the hole; and sealing material disposed in between the first substrate and the lower surface of the sheet and in between the second substrate the upper surface of the sheet, wherein the sealing material is disposed along the edge of the hole, and the sheet is made of a substance allowing laser sealing of the sealing material, first substrate and second substrate.