Hermetic Mounting System for Downhole Electronics Modules

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Solution Overview

Problem

Drilling conditions in boreholes induce intense shock and vibration, leading to electronics failure, fatigue, and accelerated aging in devices and components used in drill strings, necessitating enhanced protection for sensitive equipment.

Innovation Solution

The solution involves a mounting system comprising a housing, a lid, a biasing member, and a securing member, which forms a hermetically sealed pocket in a borehole string to securely hold and protect electronics modules from shock and vibration, using a biasing member to compress the housing against a seating surface and a heat transfer pad for shock absorption and heat dissipation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If electronic components are disposed downhole for control and data purposes, then functionality and productivity are improved, but shock and vibration cause electronics failure, fatigue and accelerated aging

Engineering Contradiction:

Improvedrilling productivityVSAvoidelectronics reliability

Core Design Contradiction:

ProductivityVSReliability

Solution Approach 1:

The electronic component system is segmented into multiple protective layers: an inner hermetic seal housing containing the electronics module, an outer shock-absorbing housing with vibration-damping material, and intermediate mounting structures. This multi-layer segmentation isolates the sensitive electronics from direct exposure to shock and vibration while maintaining downhole functionality.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Vibration damping material is pre-installed within the housing structure before the electronic components are subjected to downhole conditions. This beforehand cushioning creates a protective buffer that absorbs shock and vibration energy, preventing damage to the electronics while allowing the system to operate reliably in high-stress drilling environments.

Inventive Principle:

Principle #11Beforehand cushioning (Prior cushioning)

2Reliability

If packaging is provided to protect from downhole conditions, then reliability is improved, but device complexity increases

Engineering Contradiction:

Improveelectronics protectionVSAvoidpackaging complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

Multiple protective functions are merged into a single integrated housing structure that combines hermetic sealing, shock absorption, and vibration damping capabilities. The housing simultaneously provides environmental protection and mechanical cushioning, reducing the number of separate components and simplifying the overall packaging system while maintaining comprehensive protection.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The housing structure is designed with multi-functionality, serving as both the hermetic seal container and the shock-absorbing protective casing. This universal design eliminates the need for separate protective layers, reducing device complexity while providing comprehensive protection against downhole conditions including temperature, pressure, vibration and shock.

Inventive Principle:

Principle #6Universality (Multi-functionality)

3Reliability

If hermetic sealing is implemented to protect electronics, then reliability is improved, but heat dissipation becomes more difficult

Engineering Contradiction:

Improvehermetic seal protectionVSAvoidheat dissipation

Core Design Contradiction:

ReliabilityVSTemperature

Solution Approach 1:

A heat transfer medium or thermal interface material is introduced as an intermediary between the electronic components and the outer housing. This mediator enables thermal energy to conduct through the hermetic seal housing structure, allowing heat dissipation while maintaining the integrity of the hermetic seal and protecting the electronics from downhole environmental conditions.

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The mounting system effectively minimizes movement and hermetically seals electronics modules, reducing the impact of shock and vibration while facilitating heat transfer, thereby enhancing the reliability and longevity of sensitive components in borehole environments.

Implementation Method 1

The biasing member responsively urges the housing against the seating surface

Methodology Applied

Scientific EffectElasticity: Elasticity

Implementation Method 2

the housing hermetically seals the electronic module

Methodology Applied

Scientific EffectHermetic sealing:

Implementation Method 3

a heat transfer pad for shock absorption and heat dissipation

Methodology Applied

Scientific EffectHeat transfer: Conduction (thermal)

Data Source

PatentUS10738591B2Multi chip module housing mounting in MWD, LWD and wireline downhole tool assemblies

Publication Date: 2020.08.11 BAKER HUGHES CO

AI summary

An apparatus for protecting an electronics module used in a borehole includes a borehole string section having at least one pocket is formed and a mount associated with the at least one pocket. The mount may include a housing, a lid, a biasing member, and a securing member. The housing receives the electronics module and is seated on a seating surface, which may be formed on the at least one pocket or the mount. The lid encloses the housing within the at least one pocket. The biasing member is in operative contact with the housing. The securing member secures the lid within the at least one pocket and compresses the lid, the housing and the biasing member in the pocket. The biasing member responsively urges the housing against the seating surface and the housing hermetically seals the electronic module.