Hermetic Optical Sub-Assembly Alignment With Lower TEC Power
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Solution Overview
Problem
High energy consumption and manufacturing complexities in next-generation optical communication devices due to strict alignment requirements and high energy needs for cooling, which hinder cost-effectiveness and efficiency.
Innovation Solution
A hermetically sealed optical communication device with integrated thermo-electrical coolers and a window for external light communication, using low-cost components and simplified manufacturing methods, such as pre-defined break lines on carrier wafers for sub-mount alignment, to reduce power consumption and manufacturing difficulties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If hermetically sealed enclosure with TEC is used to cool laser components, then temperature control and reliability are improved, but energy consumption increases
Solution Approach 1:
The device is divided into two separate hermetically sealed enclosures: one containing the laser source and another containing the modulator. Each enclosure has its own TEC for independent temperature control. This segmentation allows the system to cool only the necessary components separately, improving temperature control reliability while potentially reducing total energy consumption compared to cooling a single large enclosure with all components.
2Productivity
If strict alignment tolerances are enforced for laser-modulator coupling, then optical throughput is improved, but manufacturing complexity and cost increase
Solution Approach 1:
Alignment features and mechanical coupling structures are pre-designed and pre-positioned during the manufacturing of the separate enclosures. The laser enclosure and modulator enclosure are manufactured with built-in alignment references that guide their relative positioning when coupled together. This preliminary preparation of alignment features reduces the complexity of final assembly while maintaining strict optical alignment tolerances for high throughput.
3Reliability
If hermetically sealed enclosures are used for laser and modulator, then component protection and stability are improved, but manufacturing difficulty increases
Solution Approach 1:
Instead of creating one large hermetically sealed enclosure containing both laser and modulator, the system uses two smaller separate hermetically sealed enclosures. Each smaller enclosure is easier to manufacture and seal with appropriate tolerances. The laser enclosure can be hermetically sealed independently, and the modulator enclosure can be hermetically sealed independently, reducing the overall manufacturing difficulty compared to a single integrated sealed structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution results in a more energy-efficient, cost-effective, and reliable optical communication device with reduced power consumption and simplified manufacturing, while maintaining high throughput and alignment precision.
Implementation Method 1
A thermo-electrical cooler may also reside within the hermetically sealed sub-assembly for dissipating heat generated by the laser
Data Source
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AI summary
In one embodiment, an apparatus for optical communication and method of manufacturing is disclosed. An optical sub-assembly and optical platform may form the apparatus. Lasers contained in the hermetically sealed optical sub-assembly can be coupled to a modulator on the optical platform. The optical modulator can access an optical network using beams of light sent from the laser. In another embodiment, a method of manufacturing an optical communication device is disclosed. An optical sub-assembly and optical platform can form the optical communication device. Pre-defined break lines are placed on a carrier wafer. The wafer can accommodate a modulator sub-mount and a laser sub-mount. A tooling process is used to place the modulator sub-mount on an optical platform and the laser sub-mount adjacent to a thermo-electrical cooler. The laser sub-mount can be hermetically enclosed and aligned to communicate with the modulator sub-mount.