Hermetic Package Frame for Microstructure Sealing
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Solution Overview
Problem
Existing packaging methods for microstructure devices, such as micromirror arrays, are inadequate as they often require heat for sealing, which can degrade temperature-sensitive microstructures and lead to mechanical failure due to contamination and thermal activation of particles.
Innovation Solution
A hermetic packaging frame is used to bond the top surface of the microstructure to a package substrate, creating a sealed environment that can also be further covered by a package cover, with sealing mediums and metallization layers ensuring a reliable and temperature-resistant seal.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If heat is applied during bonding and sealing, then the sealing medium bonds the substrates together, but the heat degrades the temperature-sensitive microstructure device
Solution Approach 1:
The patent changes the temperature parameter from high heat to low temperature or room temperature bonding processes. This allows the sealing medium to bond the substrates together without exposing the temperature-sensitive microstructure device to degrading heat conditions, thus maintaining device integrity while achieving adequate bonding strength
Solution Approach 2:
The patent replaces thermal bonding mechanisms with mechanical or chemical bonding mechanisms that do not require high temperature. This substitution enables substrate bonding through alternative physical or chemical processes that are compatible with temperature-sensitive devices
2Strength
If heat is applied during bonding and sealing, then the sealing medium bonds the substrates together, but heat thermally activates particles causing diffusion and degradation of microstructures
Solution Approach 1:
The patent changes the temperature parameter to avoid thermal activation of particles. By conducting bonding at low or room temperature, the patent prevents the thermal energy that would otherwise activate particle diffusion and cause contamination or degradation of the microstructure device
Solution Approach 2:
The patent applies preliminary protective measures by using low-temperature bonding processes before particle diffusion can occur. This prevents the harmful thermal activation of particles that would otherwise migrate and contaminate the microstructure device during high-temperature bonding
3Strength
If heat is applied during bonding and sealing, then the sealing medium bonds the substrates together, but heat decreases anti-stiction materials within the package
Solution Approach 1:
The patent changes the temperature parameter from high heat to low temperature bonding, preserving the stability and effectiveness of anti-stiction materials within the package while still achieving adequate bonding strength through alternative bonding mechanisms
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method effectively protects temperature-sensitive microstructures from contamination and thermal degradation, maintaining the mechanical integrity and performance of the devices by providing a reliable, hermetic seal without the need for high-temperature processing.
Implementation Method 1
a package frame that is hermetically bonded to a top surface of the top device substrate and the package substrate such that the microstructure is hermetically sealed
Implementation Method 2
hermetically sealed within a space between the top surface of the top device substrate, the packaging frame, and the packaging substrate
Data Source
AI summary
Disclosed herein is a device package that comprises a device having a top substrate that is disposed on a supporting surface of a package substrate. A package frame contacts the top surface of the top substrate and top surface of the package substrate, and hermetically seals the device between the top surfaces of the top substrate and package substrate. The device can be a semiconductor device, a microstructure such as a microelectromechanical device, or other devices.