Hermetic Electronic Package Sealing with a Solid-Solution Lid Layer
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Solution Overview
Problem
Conventional bonding methods using low-melting glass for hermetically sealing piezoelectric vibrators in electronic components often result in low bonding strength between the metal lid and ceramic base members, leading to unstable sealing and reliability issues.
Innovation Solution
A bonding member made of an insulating material containing a first metal, such as silver, is used to form a solid solution layer on the surface of the lid member, which increases the bonding strength by diffusing the first metal into the outermost layer of the lid member, typically made of gold or palladium, thereby enhancing the sealability and reliability of the electronic component.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional bonding methods using low-melting glass are used to hermetically seal the piezoelectric vibrator, then the sealing function is achieved at low cost, but the bonding strength between the lid member and base member is insufficient
Solution Approach 1:
The lid member is constructed as a composite structure with a base layer (metal) and an outermost layer (different metal) with controlled thickness (1-10 μm). This composite structure enables both strong bonding to the glass bonding member and maintained electrical conductivity, resolving the contradiction between bonding strength and manufacturing complexity.
Solution Approach 2:
The invention changes the physical and chemical parameters of the lid member surface by controlling the thickness and material composition of the outermost layer. By optimizing these parameters (layer thickness 1-10 μm, specific metal compositions), the bonding strength is enhanced while maintaining electrical properties, thus improving reliability without excessive manufacturing complexity.
2Reliability
If the lid member is made of metal material for electrical conductivity, then electrical connection is achieved, but adhesion between glass and metal is poor leading to unstable hermetical sealing
Solution Approach 1:
The lid member uses a composite structure combining a metal base layer (for electrical conductivity) with a thin outermost metal layer (1-10 μm thickness) that provides optimal adhesion to the glass bonding member. This composite approach simultaneously achieves electrical connection and stable hermetical sealing.
Solution Approach 2:
The outermost layer is applied locally on the surface of the lid member with controlled thickness (1-10 μm) to provide specific adhesion properties where it contacts the bonding member, while the bulk metal material maintains electrical conductivity. This local modification resolves the adhesion problem without compromising electrical function.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The increased bonding strength and sealability of the electronic component result in a more reliable and cost-effective manufacturing process, with improved shear strength and hermetic sealing, even under vacuum or reduced pressure conditions.
Implementation Method 1
The solid solution layer is formed in a manner that the first metal of the bonding member is diffused in the outermost layer
Implementation Method 2
a lid member bonded to the base member via a bonding member in a manner that the electronic element is hermetically sealed therebetween
Data Source
AI summary
An electronic component that includes an electronic element; a base member having an upper surface on which the electronic element is mounted; and a lid member bonded to the base member via a bonding member such that the electronic element is hermetically sealed therebetween. The bonding member is made of an insulating material containing a first metal. The lid member has an outermost layer formed on at least a surface of the lid member facing the base member. The outermost layer of the lid member has a solid solution layer of the first metal and a second metal at at least a portion of the outermost layer.