Hermetic Electronic Package With Non-Bonded Power Contacts
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Solution Overview
Problem
Existing electrical coupling systems in sealed enclosures face challenges in maintaining stable conductive pathways under various environmental conditions, particularly for implantable medical devices, requiring hermetic seals and reliable connections between internal and external components.
Innovation Solution
A hermetically-sealed package is formed by disposing an electronic device and a power source within a housing, with a substrate sealed to the housing to create a non-bonded electrical connection using techniques like laser bonding, ensuring a stable and reliable electrical pathway.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If hermetic sealing is implemented to withstand environmental factors, then reliability is improved, but device complexity increases
Solution Approach 1:
The substrate serves dual functions: it provides mechanical support for the electronic device and simultaneously acts as the hermetic seal between the internal components and external environment. By integrating the sealing function into the substrate rather than using a separate seal component, the package structure is simplified while maintaining reliable electrical coupling and environmental protection.
2Object-affected harmful factors
If hermetic sealing is implemented to protect against harsh environments, then protection against harmful factors is improved, but manufacturing complexity increases
Solution Approach 1:
The substrate's own structure and material properties are utilized to provide hermetic sealing. The substrate naturally forms the barrier against environmental factors through its inherent design, eliminating the need for additional sealing components or complex sealing processes. This self-service approach simplifies manufacturing while ensuring robust protection against harsh environments.
3Reliability
If non-bonded electrical connection is formed through hermetic sealing, then reliability is improved, but electrical connection stability may be compromised
Solution Approach 1:
The electrical connection is segmented into two distinct parts: bonded connections (solder joints) that provide stable electrical pathways, and a non-bonded interface (mechanical contact) that enables hermetic sealing. This segmentation allows each connection type to optimize its function - solder joints ensure electrical stability while the mechanical contact interface maintains seal integrity, resolving the contradiction between sealing reliability and connection stability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a stable and reliable electrical connection within a hermetically-sealed environment, suitable for implantable medical devices, maintaining functionality under varying environmental conditions.
Implementation Method 1
Hermetically sealing the substrate to the housing includes laser bonding the major surface of the substrate to the housing
Data Source
AI summary
Various embodiments of a sealed package and method of forming such package are disclosed. The package can include a housing having an inner surface and an outer surface, and a substrate having a first major surface and a second major surface. The package can also include an electronic device disposed on the first major surface of the substrate, and a power source disposed at least partially within the housing. The substrate can be sealed to the housing such that a non-bonded electrical connection is formed between a device contact of the electronic device and a power source contact of the power source.