Hermetic Semiconductor Package Separator for Pressure Relief
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Solution Overview
Problem
Power semiconductor devices with hermetic cases are vulnerable to unpredictable case ruptures due to excessive internal gas pressure during high energy discharge or short-circuit failure modes, posing safety hazards and requiring costly safety measures.
Innovation Solution
A semiconductor device with a separator that separates the internal space into two chambers, featuring a deformable portion that deforms to create fluid communication between the chambers when pressure or temperature exceeds a threshold, relieving pressure and maintaining a hermetic seal.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a hermetic package is used to enclose semiconductor chips, then protection against moisture and foreign particles is improved, but vulnerability to uncontrolled case rupture during high energy discharge or short-circuit failure modes worsens
Solution Approach 1:
The internal space of the hermetic package is divided into a first chamber (containing semiconductor chips) and a second chamber (filling space) by an electrically insulating separator. This segmentation isolates the chips from direct exposure to pressure waves during failure events, reducing the risk of chip damage while maintaining hermetic protection.
Solution Approach 2:
A deformable portion is incorporated into the separator to act as a pressure relief mechanism. When internal gas pressure exceeds a threshold during high energy discharge or short-circuit failure, the deformable portion deforms to create fluid communication between chambers, relieving pressure and preventing uncontrolled case rupture while maintaining electrical insulation.
2Strength
If the hermetic case is made stronger to withstand higher pressure, then resistance to case rupture improves, but cost and device complexity increase
Solution Approach 1:
Instead of strengthening the entire housing, the patent segments the internal space and places a deformable portion only in the separator. This localized approach provides pressure relief functionality without requiring the housing itself to be more complex or stronger, reducing overall device complexity while maintaining protection.
Solution Approach 2:
The deformable portion in the separator automatically activates when pressure exceeds the threshold, creating fluid communication to relieve pressure without requiring external control systems or additional components. This self-regulating mechanism simplifies the overall device structure while effectively preventing uncontrolled rupture.
3Object-affected harmful factors
If a deformable portion is added to relieve pressure, then resistance to case rupture improves, but the hermetic seal may be compromised
Solution Approach 1:
The deformable portion is embedded within the electrically insulating separator, which acts as an intermediary structure. When the deformable portion deforms to relieve pressure, it does so within the context of the separator assembly, maintaining the overall hermetic integrity of the housing while providing controlled pressure relief functionality.
Solution Approach 2:
The deformable portion functions as a flexible element within the rigid separator structure. This flexible component can deform to relieve pressure while the surrounding rigid separator and housing maintain the hermetic seal, combining flexibility for pressure relief with rigidity for seal integrity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The device enhances reliability by preventing explosive rupturing and maintaining a hermetic seal, allowing it to withstand higher energy levels without discharging gases or debris, suitable for power applications where uncontrolled discharge is restricted.
Implementation Method 1
the deformable portion is configured to deform when a pressure difference between the first and second chambers exceeds a threshold differential pressure
Implementation Method 2
or a temperature at the deformable portion exceeds a threshold temperature
Data Source
AI summary
The present disclosure provides a semiconductor device that includes a housing having an internal space, at least one semiconductor chip arranged inside the housing, and a separator arranged inside the housing and configured to separate the internal space of the housing into a first chamber and a second chamber. The at least one semiconductor chip is arranged within the first chamber. The separator includes a deformable portion that is configured to deform when a pressure difference between the first and second chambers exceeds a threshold differential pressure or when a temperature at the deformable portion exceeds a threshold temperature, so as to transform the first chamber from a hermetically sealed chamber to an open chamber in fluid communication with the second chamber.