Hermetic Quantum Dot LED Substrate via Laser Glass Frit Sealing
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Solution Overview
Problem
Current methods for fabricating quantum dot (QD) light-emitting diode (LED) color conversion substrates are costly and fail to provide a hermetic seal, inadequately protecting QDs from the external environment, and limit luminous efficiency.
Innovation Solution
A color conversion substrate for LEDs is developed, comprising a structural body with a coefficient of thermal expansion (CTE) between 30*10−7/°C to 80*10−7/°C, formed from materials like cordierite or alumina, with a hermetic seal achieved using a low melting point glass frit sealant and laser sealing, which also enhances luminous efficiency by reflecting light forward.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple barrier layers are applied to protect QD from moisture, then protection reliability improves, but manufacturing cost increases and fabrication complexity increases
Solution Approach 1:
The patent combines multiple barrier layers into a single integrated glass substrate structure. The glass substrate inherently provides moisture barrier functionality without requiring separate coating layers, thereby maintaining protection reliability while reducing manufacturing steps and cost.
Solution Approach 2:
The glass substrate serves multiple functions simultaneously: it acts as a structural support, a moisture barrier, and a protective encapsulation for the QD. This multi-functionality eliminates the need for separate barrier layers, reducing both fabrication complexity and manufacturing cost while maintaining reliability.
2Reliability
If multiple barrier layers are applied to protect QD from moisture, then protection reliability improves, but device complexity increases
Solution Approach 1:
The patent merges the functions of multiple barrier layers into a single glass substrate component. This integration reduces the number of fabrication steps, eliminates the need for multiple coating processes, and simplifies the overall device structure while maintaining equivalent or superior protection reliability.
Solution Approach 2:
The glass substrate is designed to perform multiple protective functions simultaneously, including moisture barrier, mechanical support, and physical protection of the QD. This multi-functional design reduces device complexity by eliminating redundant components and simplifying the fabrication process.
3Reliability
If glass surface is etched to input QD, then QD encapsulation is achieved, but manufacturing cost increases
Solution Approach 1:
The patent extracts the QD encapsulation function from the complex etching process and implements it through a simpler glass substrate structure with pre-formed openings. This eliminates the need for costly and time-consuming etching operations while maintaining encapsulation integrity.
Solution Approach 2:
The patent uses a cost-effective glass substrate with simple opening structures instead of expensive etching processes. The glass substrate can be easily manufactured using standard glass processing techniques, significantly reducing manufacturing cost while achieving the same encapsulation result.
4Length of moving object
If thin glass plate is used, then device thickness is reduced, but sealing difficulty increases
Solution Approach 1:
The patent optimizes the glass substrate thickness parameter to balance mechanical strength and sealing ease. By selecting an appropriate thickness range, the substrate remains thin enough for compact devices while being thick enough to provide sufficient structural support and facilitate reliable sealing processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution provides a cost-effective, hermetic seal for QDs, improving luminous efficiency by reflecting light forward and reducing fabrication costs compared to existing methods, while allowing for mass production and removal of thickness limitations.
Implementation Method 1
laser sealing
Implementation Method 2
low melting point glass frit sealant
Implementation Method 3
reflecting light forward
Implementation Method 4
quantum dot generating strong light having a narrower wavelength
Data Source
AI summary
The present invention relates to a substrate for changing the color of a light emitting diode and a method for producing same and, more particularly, to a substrate for changing the color of a light emitting diode and a method for producing same, wherein the substrate may be hermetically sealed so that quantum dots (QD) contained inside may be completely protected from the outside and emission efficiency of the light emitting diode may be enhanced.