Hermetic Reaction Chamber for Substrate Protection

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Solution Overview

Problem

Sensitive substrates, such as OLEDs, are compromised during loading into coating apparatuses due to exposure to ambient atmosphere and moisture, leading to contamination and limited flexibility in processing temperatures and substrates, as conventional integration of glove boxes with coating apparatuses results in cross-contamination and restricted usability.

Innovation Solution

A detachable, hermetically sealable reaction chamber that can be loaded and processed within a coating apparatus, maintaining inert handling by sealing precursors and substrates from ambient conditions, allowing for separate or remote operation of the loading chamber and enabling a wide range of processing temperatures.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of operation

If substrates are loaded into coating apparatus in ambient atmosphere, then loading process is simple and fast, but substrates are exposed to moisture and contamination compromising quality

Engineering Contradiction:

Improveloading process simplicityVSAvoidmoisture and contamination exposure

Core Design Contradiction:

Ease of operationVSObject-affected harmful factors

Solution Approach 1:

The system is divided into separate functional modules: a loading chamber for substrate introduction and a processing chamber for coating. The loading chamber can be opened to ambient atmosphere for easy substrate loading, then sealed and evacuated to create an isolated environment for the processing chamber. This segmentation allows simple loading operations while protecting substrates from harmful factors during processing.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

A loading chamber acts as an intermediary between the ambient environment and the processing chamber. It provides a transition zone where substrates can be introduced from ambient atmosphere, then sealed and evacuated to isolate the processing chamber from moisture and contamination, enabling both easy loading and substrate protection.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Object-affected harmful factors

If glove box is permanently integrated to coating apparatus, then substrate handling is protected from ambient atmosphere, but temperature control is limited to about 50° C. and usability is restricted

Engineering Contradiction:

Improveambient atmosphere exposureVSAvoidprocessing temperature range and substrate types

Core Design Contradiction:

Object-affected harmful factorsVSAdaptability or versatility

Solution Approach 1:

The system uses dynamic temperature control where the processing chamber can be heated to elevated temperatures (above 50°C) during coating operations, then cooled down afterward. The loading chamber serves as a buffer that can be opened to ambient atmosphere when cool, then evacuated and sealed before heating. This dynamic approach enables both protected substrate handling and versatile temperature-dependent processing.

Inventive Principle:

Principle #15Dynamics

Solution Approach 2:

The system operates in periodic cycles: the loading chamber is opened to ambient atmosphere for substrate loading, then sealed and evacuated, followed by heating to processing temperature, coating operation, cooling, and venting. This periodic operation allows the chamber to alternate between ambient-compatible and high-temperature modes, achieving both protected handling and temperature versatility.

Inventive Principle:

Principle #19Periodic action

3Loss of time

If substrates are quickly transferred from shipment box to coating apparatus in ambient atmosphere, then transfer time is minimized, but substrate quality is compromised due to exposure

Engineering Contradiction:

Improvetransfer timeVSAvoidmoisture exposure during transfer

Core Design Contradiction:

Loss of timeVSObject-affected harmful factors

Solution Approach 1:

The loading chamber is prepared in advance by opening it to ambient atmosphere and positioning it ready for substrate insertion. Substrates can be quickly transferred from the shipment box directly into the loading chamber without exposure to uncontrolled ambient conditions. The chamber is then sealed and evacuated, creating a protected environment for subsequent processing without requiring lengthy transfer procedures.

Inventive Principle:

Principle #10Preliminary action

Data Source

PatentUS10590536B2Apparatus, method and reaction chamber

Publication Date: 2020.03.17 BENEQ OY

AI summary

The present invention relates to an apparatus, method, a reaction chamber and a use of a reaction chamber for processing a surface of a substrate by subjecting the surface of a substrate to successive surface reactions of at least a first precursor and a second precursor. The apparatus comprises a vacuum chamber; a detachable reaction chamber arranged to be installed inside the vacuum chamber, and inside which the substrate is positioned during processing and a precursor system for supplying the at least first and second precursors into the action chamber and for discharging the at least first and second precursors from the reaction chamber. According to the present invention the reaction chamber is provided as a gastight vessel.