Hermetic Implantable Sensor Conductor Porosity Reduction

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Solution Overview

Problem

Designing implantable sensors that require a hermetic seal to prevent signal degradation and failures, while being compact and biocompatible, is challenging due to issues with electrode and conductor construction, leading to inaccuracies and infections.

Innovation Solution

A sensor with a substrate made of high-temperature resistant insulating material, where electrically conductive thick film material is sintered to reduce porosity and then coated with an insulating material to create a hermetic seal, leaving exposed regions for detection electrodes, preventing fluid migration and corrosion.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional electrode and conductor construction is used in implantable sensors, then the device can be fabricated with standard techniques, but the hermetic seal fails leading to signal degradation and device failure

Engineering Contradiction:
Improvehermetic seal integrityVSAvoidconductor construction complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent changes the physical parameters of the conductor by sintering the thick film material at high temperature to reduce porosity from a porous state to a dense state. This parameter change (porosity reduction) enables the conductor to provide hermetic sealing without requiring additional sealing structures, thus improving reliability while managing complexity

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent uses composite material structure where the conductor is formed from thick film material containing metal particles in a glass matrix. This composite structure allows the conductor to simultaneously provide electrical conductivity and hermetic sealing when sintered, resolving the contradiction between seal integrity and construction complexity

Inventive Principle:
Principle #40Composite materials

2Ease of manufacture

If the conductor is made porous to facilitate fabrication, then manufacturing is easier, but fluid migration through the conductor causes corrosion and failure

Engineering Contradiction:
Improveconductor fabrication easeVSAvoidresistance to fluid migration
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The patent applies parameter change by controlling the porosity of the thick film conductor through sintering temperature and duration. The conductor transitions from a porous unfired state (easy to manufacture) to a dense fired state (resistant to fluid migration). This parameter transformation resolves the contradiction between ease of manufacture and reliability

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The sintering process induces a phase transition in the thick film material where metal particles coalesce and the glass matrix densifies, transforming the conductor from a porous green state to a dense ceramic state. This phase transition enables the conductor to achieve hermetic properties while maintaining fabrication simplicity

Inventive Principle:
Principle #36Phase transitions

3Ease of manufacture

If the insulating coating is applied before sintering, then the coating process is simpler, but the coating cracks during sintering compromising the hermetic seal

Engineering Contradiction:
Improvecoating application simplicityVSAvoidhermetic seal continuity
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The patent applies preliminary action by performing the sintering process before applying the insulating coating. This sequence ensures the conductor is already dense and dimensionally stable when coated, preventing coating cracks and maintaining hermetic seal integrity while keeping the coating process simple

Inventive Principle:
Principle #10Preliminary action

4Ease of operation

If wires extend through the skin for external connection, then electrical connection is simpler, but infection risk increases and comfort decreases

Engineering Contradiction:
Improveelectrical connection easeVSAvoidinfection risk
Core Design Contradiction:
Ease of operationVSObject-affected harmful factors

Solution Approach 1:

The patent extracts the wire penetration function by providing exposed regions of the conductor that extend through the insulating coating to form external connection points. This allows electrical connection without wires penetrating the skin, eliminating infection risk while maintaining connection ease

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The insulating coating acts as a hermetic barrier shell that encapsulates the conductor while providing exposed regions for connection. This thin film barrier prevents fluid ingress and infection while allowing electrical access, resolving the contradiction between connection ease and infection prevention

Inventive Principle:
Principle #30Flexible shells and thin films

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution minimizes failures and inaccuracies by inhibiting fluid and gas migration through the conductors, ensuring a reliable and accurate hermetic seal for implantable devices, even when exposed to bodily fluids.

Implementation Method 1

heating the electrically conductive thick film material to a first predetermined temperature, below a second predetermined melting temperature thereof, which is sufficient to sinter a plurality of metal particles in the electrically conductive thick film material

Methodology Applied
Scientific EffectSintering: Sintering

Implementation Method 2

A coating made of a second insulating material is formed over the substrate to hermetically seal at least a portion of the conductor

Methodology Applied
Scientific EffectHermetic sealing:

Data Source

PatentUS10041897B2Hermetic implantable sensor
Publication Date: 2018.08.07 MCNAIR INTERESTS LTD
  • US10041897B2 patent drawing
  • US10041897B2 patent drawing
  • US10041897B2 patent drawing

AI summary

At least one conductor is formed at a preselected location on a substrate made of a first insulating material having a high temperature resistance. The conductor is made from a solidified electrically conductive thick film material. A coating made of a second insulating material is formed over the substrate to hermetically seal at least a portion of the conductor. An exposed distal region of the conductor provides a detection electrode. The conductor has a reduced porosity that inhibits migration of fluid or constituents thereof through the conductor.