Hermetic Sensor Assembly for Corrosive Vacuum Gas Measurement

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Solution Overview

Problem

Conventional sensors used in manufacturing systems are not compatible with aggressive environments, such as corrosive conditions, high energy plasma, vacuum, and high temperatures, and fail to maintain precise gas flow control and vacuum seals.

Innovation Solution

A sensor assembly comprising a substrate with defined regions and electrical contact pads, a housing for hermetic sealing, and a sensor die aligned via alignment features, bonded with metal bonds like platinum or reactive foils, to ensure compatibility with aggressive environments and maintain accurate gas flow measurements.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional sensors are used in aggressive manufacturing environments, then manufacturing systems can perform gas flow measurements, but the sensors fail due to corrosion, material contamination, and inability to maintain vacuum seals

Engineering Contradiction:
Improvesensor compatibility with aggressive environmentsVSAvoidcorrosion and material contamination
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent introduces a hermetically sealed housing as an intermediary barrier between the sensor components and the aggressive process environment. This housing contains the sensor die and electronic components while isolating them from corrosive gases, plasma, and vacuum conditions, allowing the sensor to function reliably in previously incompatible environments

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent employs composite material structures including hermetic seals combining metal and ceramic materials, and protective coatings on the substrate. These composite constructions provide both mechanical strength and chemical resistance, enabling the sensor assembly to withstand aggressive manufacturing environments while maintaining measurement functionality

Inventive Principle:
Principle #40Composite materials

2Reliability

If sensors are designed with special geometry to be compatible with aggressive environments, then corrosion resistance improves, but the sensor geometry may adversely affect gas flow properties

Engineering Contradiction:
Improvecorrosion resistanceVSAvoidadverse effects on gas flow properties
Core Design Contradiction:
ReliabilityVSObject-generated harmful factors

Solution Approach 1:

The patent divides the sensor assembly into distinct functional zones: a process-exposed region with minimized geometry for gas flow compatibility, and a protected region housing sensitive components. The substrate is segmented into regions for electrical contacts, sensor mounting, and hermetic sealing, allowing each segment to be optimized for its specific function without compromising overall performance

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent applies different material properties and geometric characteristics to different regions of the sensor assembly. The process-facing surfaces use smooth, corrosion-resistant materials with minimal protrusions to maintain gas flow properties, while internal regions use robust materials for structural support and sealing. Electrical contact pads are localized to specific areas to minimize interference with gas flow paths

Inventive Principle:
Principle #3Local quality

3Duration of action of stationary object

If sensors are made robust for long operational life in aggressive environments, then reliability improves, but manufacturing complexity increases

Engineering Contradiction:
Improveoperational lifeVSAvoidsensor assembly structure
Core Design Contradiction:
Duration of action of stationary objectVSDevice complexity

Solution Approach 1:

The patent incorporates hermetic seals and protective structures during the manufacturing process itself, rather than adding them as post-assembly modifications. The substrate is designed with integrated seal regions and mounting features that are prepared in advance, allowing robust construction without excessive assembly steps. Alignment features are pre-formed to simplify the bonding process

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The patent combines multiple functions into integrated components: the substrate serves both as the mounting platform for the sensor die and as part of the hermetic sealing structure. The housing integrates both mechanical protection and environmental sealing functions. Electrical contacts are integrated directly into the substrate structure, eliminating separate connection components and reducing overall assembly complexity

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The sensor assembly provides reliable, long-lasting, and precise gas flow and temperature measurements in aggressive environments by minimizing corrosion, turbulence, and leakage, while maintaining vacuum and electrical conductivity.

Implementation Method 1

A metal bond bonds electrodes of the sensor die to the electrical contact pads. The metal bond includes platinum, and/or one or more metals selected from tin, indium, copper, aluminum, and/or nickel.

Methodology Applied
Scientific EffectMetallurgical bonding: Welding

Implementation Method 2

The housing is coupled to the substrate at the middle region or the outer region to provide a hermetic seal.

Methodology Applied
Scientific EffectHermetic sealing: Physical Containment

Data Source

PatentUS12553751B2Sensor assembly and methods of manufacturing thereof
Publication Date: 2026.02.17 APPLIED MATERIALS INC
  • US12553751B2 patent drawing
  • US12553751B2 patent drawing
  • US12553751B2 patent drawing

AI summary

A sensor assembly includes a substrate having an outer region, an inner region, and a middle region between the outer region and the inner region. The substrate further includes electrical contact pads on at least the inner region. The sensor assembly further includes a housing coupled to the substrate at the middle region or the outer region to provide a hermetic seal. The sensor assembly further includes a sensor die bonded to the substrate at the inner region. A metal bond bonds electrodes of the sensor die to the electrical contact pads. The metal bond includes platinum, and/or one or more metals selected from tin, indium, copper, aluminum, and/or nickel.