Heteroaromatic Silane Treatment for Copper Adhesion
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Solution Overview
Problem
The challenge in the Semi Additive Process for producing Integrated Circuit substrates is to form a strong adhesive bond between copper traces and dielectric materials without surface roughening, which is undesirable as it can impair signal integrity and increase the risk of signal loss or delay, especially in high-frequency applications like 5G systems.
Innovation Solution
A method involving the treatment of copper surfaces with a substrate comprising copper oxide with a high copper (I) to copper (II) ratio, followed by the application of silane compounds, which increases adhesion strength without etching or roughening the copper surface, thereby improving wedge void behavior and maintaining a smooth surface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a high degree of surface roughening is applied to increase adhesion, then adhesion strength is improved, but signal integrity deteriorates due to increased signal loss and delay
Solution Approach 1:
The invention changes the chemical composition parameters of the adhesion promoter system by incorporating specific heteroaromatic compounds (pyridine, pyrimidine, triazine, tetrazine, oxazole, isoxazole, triazole, tetrazole, thiazole, isothiazole, thiadiazole, trioxane, or tetrahydrofuran rings) combined with silane compounds. This chemical parameter modification enables strong adhesion without requiring surface roughening, thus maintaining signal integrity in high-frequency applications.
2Strength
If surface roughening is applied to increase adhesion, then adhesion strength is improved, but manufacturing precision deteriorates due to difficulty in forming reliable structures to desired line and space tolerance
Solution Approach 1:
The invention modifies the chemical parameters of the adhesion promotion system using heteroaromatic silane compounds, which provide effective adhesion on smooth surfaces. This allows manufacturing processes to maintain precise line and space tolerances while achieving the required adhesion strength, eliminating the need for roughening steps that compromise dimensional accuracy.
3Strength
If surface roughening is applied to increase adhesion, then adhesion strength is improved, but copper surface area is increased requiring more copper removal
Solution Approach 1:
The invention changes the chemical composition of the adhesion promoter to include heteroaromatic compounds with silane groups that can form strong bonds with copper surfaces without requiring increased surface area. This maintains the copper trace dimensions and minimizes copper removal while achieving the necessary adhesion strength.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enhances adhesion strength between copper and organic materials while preventing wedge void formation, ensuring reliable bonding and maintaining surface smoothness, even in high-frequency applications, without the need for surface etching or roughening.
Implementation Method 1
contacting at least one section of the substrate with (a) at least one silane compound of formula (I)... increasing adhesion strength between copper and organic materials
Implementation Method 2
treating the substrate yielding a substrate comprising copper oxide on at least one side of the substrate, wherein the copper oxide comprises copper (I) and copper (II) in a ratio of 90:10 or higher (mol/mol)
Data Source
AI summary
The present invention relates to a method for increasing adhesion strength between a surface of a copper, a copper alloy or a copper oxide and a surface of an organic material.