Heterocyclic Solvent Composition for Semiconductor Substrate Cleaning
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Solution Overview
Problem
There is a need for effective compositions and methods to remove residual silicone resins from semiconductor substrates after thinning processes, as these residues can interfere with further processing and affect the integrity of semiconductor devices.
Innovation Solution
A composition comprising a heterocyclic solvent and an alkyl ammonium fluoride salt, specifically represented by Formula (R)4N+F−, where R is a C3 or C4 linear alkyl group, is used to effectively remove silicone resins from semiconductor substrates, facilitating the thinning process and ensuring the cleanliness of the substrate surface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional cleaning methods are used to remove silicone resins, then the substrate surface is cleaned, but the cleaning effectiveness is insufficient and residues remain
Solution Approach 1:
The patent changes the chemical parameters of the cleaning composition by using heterocyclic solvents (such as pyrrolidone, morpholine, or pyridine derivatives) combined with specific fluorinated compounds. This parameter change enables effective decomposition of silicone resin cross-linked structures, achieving complete removal of residues that conventional cleaning methods cannot eliminate.
2Manufacturing precision
If strong cleaning agents are used to remove silicone resins, then cleaning effectiveness improves, but corrosion of the substrate and circuit patterns occurs
Solution Approach 1:
The patent introduces heterocyclic solvents as intermediary substances that mediate between the cleaning action and the substrate. These solvents dissolve silicone resins through specific chemical interactions without directly attacking the substrate or circuit patterns, thus achieving complete resin removal while preventing corrosion.
Solution Approach 2:
The patent carefully controls the concentration parameters of active ingredients (fluorinated compounds at 0.1-10 wt%) and uses heterocyclic solvents with specific chemical properties. This parameter optimization ensures sufficient cleaning power while maintaining substrate safety, avoiding the corrosion issues associated with stronger cleaning agents.
3Ease of manufacture
If conventional solvents are used for cleaning, then the process is simple, but storage stability is poor and the composition degrades over time
Solution Approach 1:
The patent creates a composite cleaning composition by combining heterocyclic solvents with fluorinated compounds. This composite formulation achieves both storage stability and cleaning effectiveness, overcoming the degradation issues of conventional single-component solvents while maintaining manufacturing simplicity.
4Manufacturing precision
If multiple cleaning steps are used to ensure complete resin removal, then cleaning completeness improves, but processing time increases
Solution Approach 1:
The patent merges multiple cleaning functions into a single composition by combining heterocyclic solvents with fluorinated compounds. This unified composition simultaneously achieves resin dissolution, decomposition, and removal in one step, eliminating the need for multiple sequential cleaning steps and reducing total processing time.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition efficiently decomposes and removes silicone resins, ensuring the substrate is clean and ready for further processing, while maintaining storage stability and preventing corrosion, thus enhancing the semiconductor fabrication process.
Implementation Method 1
a heterocyclic solvent and a fluorine-containing compound... efficiently decomposes and removes silicone resins
Implementation Method 2
A composition comprising a heterocyclic solvent and an alkyl ammonium fluoride salt... efficiently decomposes and removes silicone resins
Data Source
AI summary
Compositions for removing silicone resins and methods of thinning a substrate by using the same, as well as related methods, apparatus and systems for facilitating the removal of silicone resins are provided. The compositions for removing silicone resins, may include a heterocyclic solvent and an alkyl ammonium fluoride salt represented by a formula, (R)4N+F−, wherein R is a C1 to C4 linear alkyl group. Silicone resins may be effectively removed by using the compositions since the compositions exhibit an excellent decomposition rate with respect to the silicone resins that remain on a semiconductor substrate in a process of backside grinding of the semiconductor substrate, backside electrode formation, or the like.