Heterogeneous Antenna Packaging Structure for Low Dielectric Loss
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional dielectric materials in antenna packaging structures suffer from high dielectric loss, leading to issues such as current leakage and stray capacitance, which hinder miniaturization and reliability under high temperature and voltage conditions.
Innovation Solution
An antenna packaging structure with a substrate layer, antenna support member, and interlayer dielectrics with low dielectric loss tangent values, along with a heterogeneous and isomerous antenna structure, utilizing materials like organic composite substrates and low-temperature co-fired ceramics to reduce dielectric loss and stray capacitance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If conventional dielectric materials (such as silicon or molding compounds) are used in antenna packaging structures, then the structure can be manufactured with conventional processes, but the dielectric loss is high leading to current leakage and stray capacitance problems
Solution Approach 1:
The patent changes the dielectric loss tangent parameter from conventional values (typically >0.005) to ultra-low values (<0.01) by selecting specialized low-loss dielectric materials. This parameter change directly reduces energy loss and eliminates current leakage while maintaining compatibility with conventional manufacturing processes through standard semiconductor fabrication techniques
Solution Approach 2:
The patent employs composite material structures combining low-loss dielectric layers with conductive patterns and through-holes. The interlayer dielectric materials are specifically selected as composite structures that integrate low-loss properties with manufacturability, achieving both reduced dielectric loss and ease of fabrication through established semiconductor industry processes
2Reliability
If conventional dielectric materials are used in antenna packaging, then the manufacturing process is simple, but the reliability under high temperature and high voltage conditions is poor
Solution Approach 1:
The patent improves reliability by changing the dielectric material parameters to achieve ultra-low dielectric loss tangent values. These material parameter changes enhance the packaging structure's ability to withstand high temperature and voltage conditions, preventing signal degradation and maintaining performance stability in extreme environments
Solution Approach 2:
The patent applies local quality optimization by specifically targeting the interlayer dielectric materials in critical signal transmission regions. By enhancing the dielectric properties locally where signals are most vulnerable to loss and interference, the patent improves overall reliability without requiring complete redesign of the entire packaging structure
3Volume of moving object
If conventional dielectric materials with high dielectric loss are used, then the packaging structure can be designed simply, but miniaturization is hindered due to current leakage and stray capacitance
Solution Approach 1:
The patent enables miniaturization by changing the dielectric loss tangent parameter to ultra-low values. This parameter change reduces stray capacitance effects that typically limit miniaturization, allowing smaller packaging structures to maintain signal integrity and eliminate current leakage even at reduced dimensions
Solution Approach 2:
The patent converts the typically harmful effects of high dielectric loss into benefits by using ultra-low loss materials. The low dielectric loss property, which might seem like a minor material characteristic, actually enables miniaturization by eliminating the harmful stray capacitance and current leakage that would otherwise prevent small-scale packaging
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The structure effectively minimizes current leakage and stray capacitance, enabling smaller and more reliable packaging by using low dielectric loss materials and a heterogeneous antenna design.
Implementation Method 1
the first antenna layer is disposed on the antenna support member and electrically connected to the second antenna layer through electromagnetic radiation or physical contact
Data Source
AI summary
The present invention provides an antenna packaging structure and a manufacturing method thereof. An antenna and a chip are respectively disposed on two sides of a substrate layer, antenna layers are formed by an antenna support member, a first antenna layer located above the antenna support member and a second antenna layer located below the antenna support member together, and interlayer dielectrics of the antenna support member and the antenna layers are low dielectric loss materials, so that a heterogeneous and isomerous antenna structure is formed, thereby reducing the problems such as current leakage and stray capacitance in the packaging structure caused by dielectric loss, and reducing a size of the antenna packaging structure.