Heterogeneous Heat Pipe Layout for Qmax and Thermal Resistance

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Heat pipes in computing devices face a trade-off between maximum heat carrying capacity (Qmax) and thermal resistance, limiting their ability to handle the increased power demands of modern processors, especially in thin form factors.

Innovation Solution

Implementing heterogeneous heat pipe solutions comprising multiple heat pipes with varying thermal resistances and Qmax, optimized for both steady-state and short-term high-performance modes, by using different wick materials, thicknesses, and working fluid levels.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Power

If the Qmax of a heat pipe is increased to handle higher power levels, then the maximum heat carrying capacity is improved, but the thermal resistance increases which impacts heat removal capability

Engineering Contradiction:
Improvemaximum heat carrying capacity (Qmax)VSAvoidthermal resistance
Core Design Contradiction:
PowerVSTemperature

Solution Approach 1:

The heat pipe system is segmented into multiple heterogeneous heat pipes with different Qmax values and thermal resistance characteristics. Each heat pipe is optimized for specific operating conditions, allowing the system to handle both high power levels and maintain low thermal resistance through parallel operation of multiple specialized heat pipes

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Different regions of the heat pipe system use heat pipes with locally optimized properties. Some heat pipes are designed with higher Qmax for handling peak thermal loads, while others are optimized for lower thermal resistance during steady-state operation. This local quality differentiation allows simultaneous optimization for both high power handling and efficient heat removal

Inventive Principle:
Principle #3Local quality

2Power

If the Qmax is increased to accommodate processor power range, then the heat carrying capacity is improved, but the thermal resistance increases reducing heat removal efficiency

Engineering Contradiction:
Improveheat carrying capacityVSAvoidheat removal efficiency
Core Design Contradiction:
PowerVSReliability

Solution Approach 1:

The system divides the heat removal function across multiple heterogeneous heat pipes, each with specialized Qmax and thermal resistance characteristics. This segmentation allows the system to simultaneously achieve high heat carrying capacity and efficient heat removal by routing different thermal loads through appropriately matched heat pipes

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The heterogeneous heat pipe system provides multi-functionality by handling both steady-state thermal management and transient high-power thermal spikes through its diverse heat pipe population. The system universally addresses different operating conditions without sacrificing either heat carrying capacity or removal efficiency

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Heterogeneous heat pipes provide improved thermal management, maintaining low thermal resistance while accommodating high Qmax, enabling processors to operate efficiently over their full power range.

Implementation Method 1

a first wick structure configured to transfer the working fluid from the condenser to the evaporator... a second wick structure configured to transfer the working fluid from the condenser to the evaporator

Methodology Applied
Scientific EffectCapillary action: Capillary Action

Implementation Method 2

a first heat pipe thermally coupled to the processor at a first end of the first heat pipe and thermally coupled to the heat sink at a second end of the first heat pipe

Methodology Applied
Scientific EffectHeat pipe: Heat Pipe

Data Source

PatentUS12414269B2Interleaved heterogeneous heat pipes with different Q<sub>max </sub>
Publication Date: 2025.09.09 INTEL CORP
  • US12414269B2 patent drawing
  • US12414269B2 patent drawing
  • US12414269B2 patent drawing

AI summary

Heterogeneous heat pipe solutions provide both low thermal resistance and a high Qmax. Some heterogeneous heat pipe solutions comprise multiple homogenous heat pipes operating in parallel, with each homogeneous heat pipe having its thermal performance tailored to handle a processor operating in a particular power mode. Other heterogeneous heat pipe solutions comprise one or more heterogeneous heat pipes, each heterogeneous heat pipe having more than wick, each wick having a different set of wick characteristics (wick material, wick thickness, etc.). Heterogeneous heat pipes can provide a thermal management solution for processors over their full operating power range.