Heterogeneous IC Package Bonding for High-Density Integration
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Integrated circuit packages face integration issues due to differences in materials and dimensions of package components, leading to increased complexity and the need for creative integration solutions as package size and density requirements increase.
Innovation Solution
A heterogeneous integration scheme is employed, using underbump metallization joints and direct bonding methods to attach semiconductor package components to an interposer substrate, allowing for multiple bonding methods such as hybrid bonding and under-bump metallization, facilitating the integration of various semiconductor devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple bonding methods are used to integrate diverse semiconductor package components, then the functionality and integration level increase, but the package component integration complexity increases
Solution Approach 1:
The patent employs multiple bonding methods (underbump metallization joints and direct bonding) within the same integrated circuit package to attach different semiconductor package components. This multi-functional approach allows the system to handle diverse materials and dimensions, achieving higher integration levels while managing complexity through methodological diversity rather than structural complexity
2Adaptability or versatility
If package size increases to accommodate more components, then the functionality increases, but the integration issues due to material and dimension differences increase
Solution Approach 1:
The patent applies different bonding methods to different regions and components within the package based on their specific material properties and dimensional requirements. Underbump metallization joints are used for certain components while direct bonding is used for others, allowing each component to be integrated with the optimal method for its specific characteristics, thereby managing integration issues in larger packages
3Productivity
If package component density increases to meet requirements, then the productivity increases, but the need for creative integration solutions increases
Solution Approach 1:
The patent utilizes vertical stacking and multi-layer integration to achieve high component density. By integrating components in three dimensions rather than just planar arrangements, and by combining different bonding methods to attach components at various heights and positions, the system achieves high density while managing integration complexity through spatial optimization
Data Source
AI summary
Integrated circuit package structures and methods of forming integrated circuit package structures are discussed. An integrated circuit package structure, in accordance with some embodiments, includes an integrated circuit package substrate with a heterogeneous bonding scheme that includes conductive pillars for bonding semiconductor devices to as well as a region including conductive connectors embedded in a dielectric for bonding additional semiconductor devices.